Inventor · disambiguated record
Uidam Jung
Also filed as: JUNG UIDAM
3 granted patents·1 pending application·3 citations·filing 2020–2024
55Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0191US11532581B2Semiconductor devices having bonding structures with bonding pads and metal patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 20, 2022·3 cites·20 claims
- 0274US2024379647A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0373US12080699B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·8 claims
- 0464US11527524B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →