Inventor · disambiguated record
Thomas Kieran Nunan
Also filed as: NUNAN THOMAS K · NUNAN THOMAS KIERAN
23 granted patents·3 pending applications·355 citations·filing 2002–2022
95Inventor score
Top patents by PatentIndex Score
26 records- 0198US7825484B2Micromachined microphone and multisensor and method for producing sameANALOG DEVICES INC·Filed 2005·Granted Nov 2, 2010·148 cites·11 claims
- 0296US7138694B2Single crystal silicon sensor with additional layer and method of producing the sameANALOG DEVICES INC·Filed 2004·Granted Nov 21, 2006·59 cites·17 claims
- 0392US8227876B2Single crystal silicon sensor with additional layer and method of producing the sameNUNAN THOMAS KIERAN·Filed 2006·Granted Jul 24, 2012·24 cites·7 claims
- 0492US8129803B2Micromachined microphone and multisensor and method for producing sameMARTIN JOHN R·Filed 2010·Granted Mar 6, 2012·11 cites·20 claims
- 0592US6936918B2MEMS device with conductive path through substrateANALOG DEVICES INC·Filed 2004·Granted Aug 30, 2005·78 cites·23 claims
- 0685US8227286B2Single crystal silicon sensor with additional layer and method of producing the sameNUNAN THOMAS KIERAN·Filed 2011·Granted Jul 24, 2012·5 cites·16 claims
- 0784US8507306B2Reduced stiction MEMS device with exposed silicon carbideCHEN LI·Filed 2010·Granted Aug 13, 2013·6 cites·19 claims
- 0883US9764946B2MEMs device with outgassing shieldANALOG DEVICES INC·Filed 2013·Granted Sep 19, 2017·5 cites·20 claims
- 0976US11614328B2Sensing devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Mar 28, 2023·1 cites·19 claims
- 1076US9556017B2Apparatus and method for preventing stiction of MEMS devices encapsulated by active circuitryANALOG DEVICES INC·Filed 2013·Granted Jan 31, 2017·3 cites·20 claims
- 1176US8749036B2Microchip with blocking apparatus and method of fabricating microchipANALOG DEVICES INC·Filed 2012·Granted Jun 10, 2014·2 cites·7 claims
- 1275US8507913B2Method of bonding wafersNUNAN THOMAS KIERAN·Filed 2010·Granted Aug 13, 2013·4 cites·20 claims
- 1371US9242856B2Microchip with blocking apparatusANALOG DEVICES INC·Filed 2014·Granted Jan 26, 2016·1 cites·14 claims
- 1464US12388411B2Single anchor resonatorsPANASONIC IP MAN CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·14 claims
- 1558US8389314B2MEMS device with roughened surface and method of producing the sameMARTIN JOHN R·Filed 2006·Granted Mar 5, 2013·2 cites·12 claims
- 1655US11358858B2Semiconductor device and method of manufacturing thereofPANASONIC IP MAN CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·26 claims
- 1751US9917243B2Method of fabricating piezoelectric MEMS devicesANALOG DEVICES INC·Filed 2014·Granted Mar 13, 2018·0 cites·20 claims
- 1848US10081535B2Apparatus and method for shielding and biasing in MEMS devices encapsulated by active circuitryANALOG DEVICES INC·Filed 2013·Granted Sep 25, 2018·0 cites·29 claims
- 1948US6747338B1Composite dielectric with improved etch selectivity for high voltage MEMS structuresANALOG DEVICES INC·Filed 2002·Granted Jun 8, 2004·6 cites·15 claims
- 2048US2024077312A1Systems and methods for acoustically isolated resonatorsPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 2147US7754617B2Polysilicon deposition and anneal process enabling thick polysilicon films for MEMS applicationsANALOG DEVICES INC·Filed 2008·Granted Jul 13, 2010·0 cites·20 claims
- 2246US9105644B2Apparatus and method for forming alignment features for back side processing of a waferANALOG DEVICES INC·Filed 2013·Granted Aug 11, 2015·0 cites·10 claims
- 2345US9446948B1Apparatus and method of forming a MEMS device with etch channelsANALOG DEVICES INC·Filed 2015·Granted Sep 20, 2016·0 cites·20 claims
- 2443US11097942B2Through silicon via (TSV) formation in integrated circuitsANALOG DEVICES INC·Filed 2016·Granted Aug 24, 2021·0 cites·18 claims
- 2540US2006148133A1Method of forming a MEMS deviceANALOG DEVICES INC·Filed 2005·Application pending·0 cites
- 2636US2010320548A1Silicon-Rich Nitride Etch Stop Layer for Vapor HF Etching in MEMS Device FabricationANALOG DEVICES INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →