Inventor · disambiguated record
Seung Yeol Yang
Also filed as: YANG SEUNG-YEOL
7 granted patents·4 pending applications·2 citations·filing 2007–2023
70Inventor score
Top patents by PatentIndex Score
11 records- 0172US10616998B2Circuit board and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 7, 2020·2 cites·20 claims
- 0265US12189237B2Display deviceLG DISPLAY CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·19 claims
- 0353US2020236778A1Circuit board and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 0449US7834439B2Semiconductor module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 16, 2010·0 cites·18 claims
- 0548US11903145B2Wiring board and semiconductor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·18 claims
- 0647US8004091B2Semiconductor package, method of fabricating the same, and semiconductor package moldSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 23, 2011·0 cites·25 claims
- 0741US9530755B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 27, 2016·0 cites·12 claims
- 0840US2015060869A1Supporting substrate for manufacturing flexible informaiton display device using temporary bonding/debonding layer, manufacturing method thereof, and flexible information display deviceRO JAE-SANG·Filed 2014·Application pending·0 cites
- 0940US2015060870A1Supporting substrate for manufacturing flexible information display device, manufacturing method thereof, and flexible information display deviceRO JAE-SANG·Filed 2014·Application pending·0 cites
- 1038US2008023814A1Stacked ball grid array semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1137US9543205B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 10, 2017·0 cites·20 claims
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