Inventor · disambiguated record
Michael Kerstan
Also filed as: KERSTAN MICHAEL
14 granted patents·3 pending applications·95 citations·filing 1999–2022
90Inventor score
Files withSILTRONIC AG7PIETSCH GEORG4SCHWANDNER JUERGEN3KERSTAN MICHAEL1WACKER SILTRONIC HALBLEITERMAT1
Top patents by PatentIndex Score
17 records- 0189US8113913B2Method for the simultaneous grinding of a plurality of semiconductor wafersPIETSCH GEORG·Filed 2008·Granted Feb 14, 2012·22 cites·29 claims
- 0288US7867059B2Semiconductor wafer, apparatus and process for producing the semiconductor waferSILTRONIC AG·Filed 2007·Granted Jan 11, 2011·21 cites·16 claims
- 0383US7815489B2Method for the simultaneous double-side grinding of a plurality of semiconductor wafersSILTRONIC AG·Filed 2007·Granted Oct 19, 2010·15 cites·24 claims
- 0474US9011209B2Method and apparatus for trimming the working layers of a double-side grinding apparatusSILTRONIC AG·Filed 2014·Granted Apr 21, 2015·2 cites·2 claims
- 0574US7077726B2Semiconductor wafer with improved local flatness, and method for its productionSILTRONIC AG·Filed 2002·Granted Jul 18, 2006·16 cites·3 claims
- 0664US9539695B2Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafersPIETSCH GEORG·Filed 2008·Granted Jan 10, 2017·3 cites·26 claims
- 0764US8911281B2Method for trimming the working layers of a double-side grinding apparatusPIETSCH GEORG·Filed 2011·Granted Dec 16, 2014·1 cites·5 claims
- 0862US8974267B2Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafersPIETSCH GEORG·Filed 2011·Granted Mar 10, 2015·1 cites·13 claims
- 0957US8986070B2Method for trimming the working layers of a double-side grinding apparatusSILTRONIC AG·Filed 2014·Granted Mar 24, 2015·0 cites·4 claims
- 1053US8512099B2Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafersKERSTAN MICHAEL·Filed 2009·Granted Aug 20, 2013·2 cites·13 claims
- 1153US2024379342A1Method for grinding semiconductor wafersSILTRONIC AG·Filed 2022·Application pending·0 cites
- 1248US2023162969A1Method for grinding semiconductor wafersSILTRONIC AG·Filed 2021·Application pending·0 cites
- 1344US6362487B1Method and device for nondestructive detection of crystal defectsWACKER SILTRONIC HALBLEITERMAT·Filed 1999·Granted Mar 26, 2002·12 cites·7 claims
- 1441US10707069B2Method for polishing a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted Jul 7, 2020·0 cites·20 claims
- 1540US2005173377A1Semiconductor wafer, apparatus and process for producing the semiconductor waferFiled 2005·Application pending·0 cites
- 1638US8529315B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted Sep 10, 2013·0 cites·12 claims
- 1736US8685270B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Apr 1, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →