Inventor · disambiguated record
Jae Bong Shin
Also filed as: SHIN JAE BONG
5 granted patents·4 pending applications·28 citations·filing 2004–2016
76Inventor score
Top patents by PatentIndex Score
9 records- 0177US7650687B2Die attaching apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 26, 2010·7 cites·14 claims
- 0273US9431365B2Apparatus for bonding semiconductor chipsSEOK SEUNG-DAE·Filed 2015·Granted Aug 30, 2016·4 cites·20 claims
- 0370US10058952B2Bonding stage and bonding apparatus comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·16 claims
- 0457US7294204B2Apparatus for painting traffic marks on road surfaceKOREA JOONGANG HAK WONCO LTD·Filed 2004·Granted Nov 13, 2007·14 cites·5 claims
- 0556US9508577B2Semiconductor manufacturing apparatuses comprising bonding headsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 29, 2016·1 cites·3 claims
- 0647US2010071847A1Wafer bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0739US2013248114A1Chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0839US2013139380A1Chip bonding apparatus and chip bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 0936US2012118876A1Flip chip bonding apparatus and manufacturing method thereofCHO JUNG HYUN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →