Inventor · disambiguated record
Ching-Tien Ma
Also filed as: MA CHING-TIEN
10 granted patents·236 citations·filing 2000–2009
89Inventor score
Top patents by PatentIndex Score
10 records- 0193US6764810B2Method for dual-damascene formation using a via plugTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 20, 2004·150 cites·20 claims
- 0286US6316351B1Inter-metal dielectric film composition for dual damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Nov 13, 2001·43 cites·21 claims
- 0367US7655554B2Method for eliminating loading effect using a via plugSEMICONDUCTOR MFG INT SHANGHAI·Filed 2008·Granted Feb 2, 2010·6 cites·13 claims
- 0465US6583062B1Method of improving an aspect ratio while avoiding etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 24, 2003·12 cites·20 claims
- 0563US6830877B2Method for forming via and contact holes with deep UV photoresistTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 14, 2004·11 cites·14 claims
- 0658US6570257B2IMD film composition for dual damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted May 27, 2003·6 cites·10 claims
- 0755US7629673B2Contact etch stop filmSEMICONDUCTOR MFG INT SHANGHAI·Filed 2006·Granted Dec 8, 2009·2 cites·8 claims
- 0849US8089153B2Method for eliminating loading effect using a via plugHUI WU XIANG·Filed 2009·Granted Jan 3, 2012·2 cites·10 claims
- 0948US6652666B2Wet dip method for photoresist and polymer stripping without buffer treatment stepTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 25, 2003·4 cites·22 claims
- 1046US7939915B2Contact etch stop filmSEMICONDUCTOR MFG INT SHANGHAI·Filed 2009·Granted May 10, 2011·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →