Inventor · disambiguated record
Jin-Tau Chou
Also filed as: CHOU JIN-TAU
3 granted patents·35 citations·filing 2000–2004
70Inventor score
Files withUNITED MICROELECTRONICS CORP3
Top patents by PatentIndex Score
3 records- 0174US6762466B2Circuit structure for connecting bonding pad and ESD protection circuitUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jul 13, 2004·21 cites·9 claims
- 0262US6927457B2Circuit structure for connecting bonding pad and ESD protection circuitUNITED MICROELECTRONICS CORP·Filed 2004·Granted Aug 9, 2005·10 cites·4 claims
- 0350US6429082B1Method of manufacturing a high voltage using a latid process for forming a LDDUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 6, 2002·4 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →