Inventor · disambiguated record
Meng-Tsung Kuo
Also filed as: KUO MENG-TSUNG
2 granted patents·3 pending applications·0 citations·filing 2021–2025
28Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5
Top patents by PatentIndex Score
5 records- 0180US2025349787A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0272US2024250055A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0371US2025316560A1Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0465US11978715B2Structure and formation method of chip package with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 0561US12374600B2Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Meng-Tsung Kuo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →