Inventor · disambiguated record
Yao-Chun Su
Also filed as: SU YAO · SU YAO-CHUN
18 granted patents·6 pending applications·62 citations·filing 2005–2023
92Inventor score
Files withMEDIATEK INC13VIA TECH INC5SHEN ZHEN SHI AIKER ELECTRONIC TECH CO LTD3HONG WEI-HSIANG1SU YAO-CHUN1
Top patents by PatentIndex Score
24 records- 0197US12183723B2Semiconductor package with dummy MIM capacitor dieMEDIATEK INC·Filed 2022·Granted Dec 31, 2024·3 cites·12 claims
- 0295US11222850B2Electronic package with rotated semiconductor dieMEDIATEK INC·Filed 2020·Granted Jan 11, 2022·4 cites·17 claims
- 0394US11830820B2Electronic package with rotated semiconductor dieMEDIATEK INC·Filed 2021·Granted Nov 28, 2023·2 cites·14 claims
- 0489US11508707B2Semiconductor package with dummy MIM capacitor dieMEDIATEK INC·Filed 2020·Granted Nov 22, 2022·2 cites·20 claims
- 0588USD962859SWireless chargerSHEN ZHEN SHI AIKER ELECTRONIC TECH CO LTD·Filed 2020·Granted Sep 6, 2022·18 cites·1 claims
- 0684US10127169B2Supporting flow control mechanism of bus between semiconductor dies assembled in wafer-level packageMEDIATEK INC·Filed 2016·Granted Nov 13, 2018·4 cites·20 claims
- 0782US10152445B2Signal count reduction between semiconductor dies assembled in wafer-level packageMEDIATEK INC·Filed 2016·Granted Dec 11, 2018·4 cites·25 claims
- 0879US12388026B2Electronic package with rotated semiconductor dieMEDIATEK INC·Filed 2023·Granted Aug 12, 2025·0 cites·16 claims
- 0976US7315953B2Apparatus and related method of coordinating north bridge and south bridge for processing bus master requests of peripheral devices for controlling a central processing unit to operate in a power-saving stateVIA TECH INC·Filed 2005·Granted Jan 1, 2008·8 cites·20 claims
- 1075US9934179B2Wafer-level package with at least one input/output port connected to at least one management busMEDIATEK INC·Filed 2016·Granted Apr 3, 2018·2 cites·20 claims
- 1175US7475263B2Method for power management of central processor unitVIA TECH INC·Filed 2006·Granted Jan 6, 2009·7 cites·20 claims
- 1271US9846657B2Electronic device for packing multiple commands in one compound command frame and electronic device for decoding and executing multiple commands packed in one compound command frameMEDIATEK INC·Filed 2015·Granted Dec 19, 2017·2 cites·10 claims
- 1368US8078786B2Method and system for request accessing and schedulingHONG WEI-HSIANG·Filed 2007·Granted Dec 13, 2011·5 cites·18 claims
- 1455US7631127B2Methods and systems for varying bus frequenciesVIA TECHNOLOGIES·Filed 2007·Granted Dec 8, 2009·1 cites·12 claims
- 1553US2024242016A1Automatic layout routing flow for package substrate design evaluationMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1650US9852101B2Electronic device with enhanced management data input/output controlMEDIATEK INC·Filed 2014·Granted Dec 26, 2017·0 cites·4 claims
- 1747US7882401B2Chip for use with both high-speed bus and low-speed bus and operation method thereofVIA TECH INC·Filed 2007·Granted Feb 1, 2011·0 cites·22 claims
- 1844US2021167624A1Adaptive Magnetic Wireless ChargerSHEN ZHEN SHI AIKER ELECTRONIC TECH CO LTD·Filed 2021·Application pending·0 cites
- 1942US2008263254A1Method and System For Adjusting Bus Frequency And Link Width On A BusVIA TECH INC·Filed 2007·Application pending·0 cites
- 2042US2020144858A1Electronic Device Protective Case for WirelessSHEN ZHEN SHI AIKER ELECTRONIC TECH CO LTD·Filed 2020·Application pending·0 cites
- 2141US2006271714A1Data retrieving methodsVIA TECH INC·Filed 2006·Application pending·0 cites
- 2237US10397142B2Multi-chip structure having flexible input/output chipsMEDIATEK INC·Filed 2016·Granted Aug 27, 2019·0 cites·21 claims
- 2337US8166226B2Apparatus and related method for maintaining read caching data of south bridge with north bridgeSU YAO-CHUN·Filed 2005·Granted Apr 24, 2012·0 cites·15 claims
- 2428US2017147517A1Direct memory access system using available descriptor mechanism and/or pre-fetch mechanism and associated direct memory access methodMEDIATEK INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →