Inventor · disambiguated record
Hiromitsu Maruyama
Also filed as: MARUYAMA HIROMITSU
6 granted patents·4 pending applications·69 citations·filing 2008–2023
79Inventor score
Top patents by PatentIndex Score
10 records- 0183USD628170SSemiconductor wafer processing tapeFURUKAWA ELECTRIC CO LTD·Filed 2008·Granted Nov 30, 2010·33 cites·1 claims
- 0283USD621803SSemiconductor wafer processing tapeFURUKAWA ELECTRIC CO LTD·Filed 2008·Granted Aug 17, 2010·33 cites·1 claims
- 0361US9631123B2Adhesive sheetFURUKAWA ELECTRIC CO LTD·Filed 2014·Granted Apr 25, 2017·1 cites·11 claims
- 0461US9523023B2Adhesive sheetFURUKAWA ELECTRIC CO LTD·Filed 2014·Granted Dec 20, 2016·1 cites·9 claims
- 0558US2024084172A1Adhesive composition, film adhesive, and semiconductor package using film adhesive and producing method thereofFURUKAWA ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 0656US9324592B2Wafer processing tapeMARUYAMA HIROMITSU·Filed 2008·Granted Apr 26, 2016·1 cites·7 claims
- 0752US2022367234A1Dicing die attach film and method of producing the same, and semiconductor package and method of producing the sameFURUKAWA ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 0852US2022310547A1Dicing die attach film and method of producing the same, and semiconductor package and method of producing the sameFURUKAWA ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 0942US9324593B2Wafer processing tapeMARUYAMA HIROMITSU·Filed 2012·Granted Apr 26, 2016·0 cites·10 claims
- 1042US2015017373A1Adhesive sheetFURUKAWA ELECTRIC CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →