Inventor · disambiguated record
Yen Hsi Tang
Also filed as: TANG YEN HSI · TANG YEN HSI TERRY
7 granted patents·2 pending applications·23 citations·filing 2003–2020
78Inventor score
Top patents by PatentIndex Score
9 records- 0170US7977231B1Die bonder incorporating dual-head dispenserASM ASSEMBLY AUTOMATION LTD·Filed 2010·Granted Jul 12, 2011·5 cites·20 claims
- 0258US7179346B2Semiconductor apparatus with multiple delivery devices for componentsASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Feb 20, 2007·7 cites·17 claims
- 0358US7084532B2Decoupling of actuators for positioning an objectASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Aug 1, 2006·9 cites·20 claims
- 0454US7514825B2Linear motor cooling apparatus with air amplificationASM ASSEMBLY AUTOMATION LTD·Filed 2006·Granted Apr 7, 2009·2 cites·18 claims
- 0544US11136202B2Direct transfer apparatus for electronic componentsASM TECH SINGAPORE PTE LTD·Filed 2020·Granted Oct 5, 2021·0 cites·16 claims
- 0640US2014341691A1Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bondingLAM KUI KAM·Filed 2014·Application pending·0 cites
- 0737US8804136B2Apparatus and method for locating a plurality of placement positions on a carrier objectLAM KUI KAM·Filed 2012·Granted Aug 12, 2014·0 cites·19 claims
- 0835US8590143B2Apparatus for delivering semiconductor components to a substrateLAM KUI KAM·Filed 2011·Granted Nov 26, 2013·0 cites·8 claims
- 0927US2012094440A1Method of die bonding onto dispensed adhesivesCHUNG KWOK KEE·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →