Inventor · disambiguated record
Kai-Hsiang Yen
Also filed as: YEN KAI-HSIANG
10 granted patents·2 pending applications·53 citations·filing 2002–2011
85Inventor score
Top patents by PatentIndex Score
12 records- 0193US7902843B2SensorIND TECH RES INST·Filed 2008·Granted Mar 8, 2011·30 cites·13 claims
- 0273US8039910B2Electro-acoustic sensing deviceIND TECH RES INST·Filed 2007·Granted Oct 18, 2011·6 cites·17 claims
- 0356US7125795B2Fabrication method for microstructures with high aspect ratiosIND TECH RES INST·Filed 2004·Granted Oct 24, 2006·7 cites·9 claims
- 0454US8144899B2Acoustic transducer and microphone using the sameSONG PO-HSUN·Filed 2008·Granted Mar 27, 2012·3 cites·20 claims
- 0549US6600644B1Microelectronic tunable capacitor and method for fabricationIND TECH RES INST·Filed 2002·Granted Jul 29, 2003·7 cites·11 claims
- 0643US8035402B2SensorIND TECH RES INST·Filed 2011·Granted Oct 11, 2011·0 cites·6 claims
- 0740US6804443B2Test structure and method of step coverage for optical waveguide productionIND TECH RES INST·Filed 2003·Granted Oct 12, 2004·0 cites·11 claims
- 0839US8508022B2Ultra thin package for electric acoustic sensor chip of micro electro mechanical systemHO TZONG-CHE·Filed 2008·Granted Aug 13, 2013·0 cites·18 claims
- 0939US7208065B2Structure for measuring the etching speedIND TECH RES INST·Filed 2004·Granted Apr 24, 2007·0 cites·6 claims
- 1037US6828164B2Method for measuring the etching speedIND TECH RES INST·Filed 2003·Granted Dec 7, 2004·0 cites·6 claims
- 1136US2004018720A1Fabrication method for microstructures with high aspect ratiosFiled 2003·Application pending·0 cites
- 1235US2006001114A1Apparatus and method of wafer level packageCHEN JEN-YI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →