Inventor · disambiguated record
Binneg Y. Lao
Also filed as: LAO BINNEG Y · LAO BINNEG YANBING
14 granted patents·1 pending application·650 citations·filing 1976–2012
94Inventor score
Top patents by PatentIndex Score
15 records- 0197US4593243ACoplanar and stripline probe card apparatusMAGNAVOX CO·Filed 1984·Granted Jun 3, 1986·145 cites·28 claims
- 0296US4739448AMicrowave multiport multilayered integrated circuit chip carrierMAGNAVOX CO·Filed 1984·Granted Apr 19, 1988·214 cites·22 claims
- 0394US6639461B1Ultra-wideband power amplifier module apparatus and method for optical and electronic communicationsSIERRA MONOLITHICS INC·Filed 2001·Granted Oct 28, 2003·111 cites·34 claims
- 0489US4384409ASurface acoustic wave gyroscopeBENDIX CORP·Filed 1980·Granted May 24, 1983·50 cites·39 claims
- 0578US6803252B2Single and multiple layer packaging of high-speed/high-density ICsSIERRA MONOLITHICS INC·Filed 2001·Granted Oct 12, 2004·28 cites·56 claims
- 0672US8159052B2Apparatus and method for a chip assembly including a frequency extending deviceLAO BINNEG Y·Filed 2008·Granted Apr 17, 2012·6 cites·27 claims
- 0771US6509801B1Multi-gigabit-per-sec clock recovery apparatus and method for optical communicationsSIERRA MONOLITHICS INC·Filed 2001·Granted Jan 21, 2003·21 cites·28 claims
- 0860US4072046AAcoustic pycnometerDOW CHEMICAL CO·Filed 1976·Granted Feb 7, 1978·15 cites·4 claims
- 0959US8525313B2Chip assembly with frequency extending deviceLAO BINNEG Y·Filed 2012·Granted Sep 3, 2013·1 cites·22 claims
- 1057US4238662APressure-sensing capacitor and method of trimming sameBENDIX CORP·Filed 1978·Granted Dec 9, 1980·10 cites·11 claims
- 1156US4292659APressure sensing capacitive transducerBENDIX CORP·Filed 1979·Granted Sep 29, 1981·19 cites·5 claims
- 1253US4584475ASurface acoustic wave infrared line imaging arrayALLIED CORP·Filed 1984·Granted Apr 22, 1986·12 cites·22 claims
- 1346US5406847ASuperconducting gyroscopeSIERRA MONOLITHICS INC·Filed 1994·Granted Apr 18, 1995·11 cites·30 claims
- 1440US4387602APressure compensated circuit for ion mass airflow sensorsBENDIX CORP·Filed 1981·Granted Jun 14, 1983·7 cites·32 claims
- 1534US2003095014A1Connection package for high-speed integrated circuitFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →