Inventor · disambiguated record
Yukio Maki
Also filed as: MAKI YUKIO
20 granted patents·6 pending applications·158 citations·filing 1994–2024
94Inventor score
Files withRENESAS ELECTRONICS CORP10MITSUBISHI ELECTRIC CORP8RENESAS TECH CORP6HIRANO YUICHI1MAKI YUKIO1
Top patents by PatentIndex Score
26 records- 0185US6774441B2Semiconductor device having an MIS transistorRENESAS TECH CORP·Filed 2003·Granted Aug 10, 2004·39 cites·7 claims
- 0273US9368504B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 14, 2016·3 cites·15 claims
- 0371US7535062B2Semiconductor device having SOI structureRENESAS TECH CORP·Filed 2007·Granted May 19, 2009·4 cites·6 claims
- 0468US6853022B2Semiconductor memory deviceRENESAS TECH CORP·Filed 2003·Granted Feb 8, 2005·17 cites·11 claims
- 0562US8987917B2Semiconductor device having non-planar interface between a plug layer and a contact layerRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 24, 2015·1 cites·18 claims
- 0662US2025203996A1Semiconductor device and method for fabricating a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0761US9905512B2Semiconductor device containing memory cells with a fuse in static random memory cell (SRAM) device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 27, 2018·1 cites·11 claims
- 0861US5384731ASRAM memory structure and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jan 24, 1995·20 cites·16 claims
- 0960US6812534B2Static semiconductor memory deviceRENESAS TECH CORP·Filed 2003·Granted Nov 2, 2004·16 cites·9 claims
- 1060US6373106B2Semiconductor device and method for fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Apr 16, 2002·25 cites·7 claims
- 1156US11476258B2Semiconductor device including short-circuit prevention structure and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2019·Granted Oct 18, 2022·0 cites·6 claims
- 1254US7061128B2Semiconductor device and manufacturing method of the sameRENESAS TECH CORP·Filed 2001·Granted Jun 13, 2006·6 cites·5 claims
- 1353US7786534B2Semiconductor device having SOI structureRENESAS TECH CORP·Filed 2009·Granted Aug 31, 2010·0 cites·8 claims
- 1450US2015076611A1Semiconductor Device and Manufacturing Method ThereofRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1544US9472495B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 18, 2016·0 cites·8 claims
- 1644US2015187645A1Semiconductor Device Having Non-Planar Interface Between a Plug Layer and a Contact LayerRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1742US6144077ASemiconductor device comprising a bipolar transistorMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Nov 7, 2000·8 cites·4 claims
- 1842US2015076612A1Semiconductor DeviceRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1941US5959334ASemiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Sep 28, 1999·6 cites·13 claims
- 2040US2008179676A1Semiconductor memory deviceHIRANO YUICHI·Filed 2008·Application pending·0 cites
- 2139US6566217B1Manufacturing process for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted May 20, 2003·6 cites·23 claims
- 2239US5744855ASingle-poly-type bipolar transistorMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Apr 28, 1998·6 cites·9 claims
- 2338US2018040365A1Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 2436US8487312B2Semiconductor device and method of manufacturing the sameMAKI YUKIO·Filed 2012·Granted Jul 16, 2013·0 cites·12 claims
- 2532US6545325B2Semiconductor device and fabrication method thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 8, 2003·0 cites·6 claims
- 2629US5726486ASemiconductor device having a bipolar transistorMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 10, 1998·0 cites·9 claims
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