Inventor · disambiguated record
Rajen Dias
Also filed as: DIAS RAJEN · DIAS RAJEN C
12 granted patents·3 pending applications·182 citations·filing 2001–2016
92Inventor score
Top patents by PatentIndex Score
15 records- 0192US7078822B2Microelectronic device interconnectsINTEL CORP·Filed 2002·Granted Jul 18, 2006·52 cites·12 claims
- 0281US6812548B2Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devicesINTEL CORP·Filed 2001·Granted Nov 2, 2004·28 cites·13 claims
- 0381US6790709B2Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devicesINTEL CORP·Filed 2001·Granted Sep 14, 2004·28 cites·6 claims
- 0475US6955947B2Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devicesINTEL CORP·Filed 2004·Granted Oct 18, 2005·19 cites·12 claims
- 0573US9859248B2Laser die backside film removal for integrated circuit (IC) packagingINTEL CORP·Filed 2016·Granted Jan 2, 2018·2 cites·20 claims
- 0671US7042729B2Thermal interface apparatus, systems, and fabrication methodsINTEL CORP·Filed 2003·Granted May 9, 2006·13 cites·23 claims
- 0770US6815831B2Flip-chip device with multi-layered underfill having graded coefficient of thermal expansionINTEL CORP·Filed 2001·Granted Nov 9, 2004·15 cites·6 claims
- 0867US9412702B2Laser die backside film removal for integrated circuit (IC) packagingINTEL CORP·Filed 2013·Granted Aug 9, 2016·2 cites·12 claims
- 0966US7314817B2Microelectronic device interconnectsINTEL CORP·Filed 2005·Granted Jan 1, 2008·3 cites·20 claims
- 1064US7064014B2Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devicesINTEL CORP·Filed 2004·Granted Jun 20, 2006·10 cites·14 claims
- 1161US6861285B2Flip chip underfill processINTEL CORP·Filed 2003·Granted Mar 1, 2005·8 cites·12 claims
- 1259US7317258B2Thermal interface apparatus, systems, and fabrication methodsINTEL CORP·Filed 2006·Granted Jan 8, 2008·2 cites·8 claims
- 1348US2008005886A1Thermal interface apparatus, systems, and fabrication methodsINTEL CORP·Filed 2007·Application pending·0 cites
- 1440US2008073061A1Variable depth microchannelsDIAS RAJEN·Filed 2006·Application pending·0 cites
- 1537US2005017371A1Electronic assembly having a die with rounded corner edge portions and a method of fabricating the sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →