Inventor · disambiguated record
Kei Miyoshi
Also filed as: MIYOSHI KEI
25 granted patents·11 pending applications·407 citations·filing 1990–2013
96Inventor score
Top patents by PatentIndex Score
36 records- 0197US7547743B2Heat conductive silicone rubber composition and molded articleSHINETSU CHEMICAL CO·Filed 2005·Granted Jun 16, 2009·27 cites·10 claims
- 0294US7705104B2Addition curable silicon resin composition for light emitting diodeSHINETSU CHEMICAL CO·Filed 2006·Granted Apr 27, 2010·18 cites·18 claims
- 0394US7595113B2LED devices and silicone resin composition thereforSHINETSU CHEMICAL CO·Filed 2005·Granted Sep 29, 2009·41 cites·7 claims
- 0493US7615387B2Addition curing silicone composition capable of producing a cured product with excellent crack resistanceSHINETSU CHEMICAL CO·Filed 2006·Granted Nov 10, 2009·16 cites·19 claims
- 0593US7323250B2Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor deviceSHINETSU CHEMICAL CO·Filed 2005·Granted Jan 29, 2008·31 cites·18 claims
- 0693US6140446AHydrosilylation catalysts and silicone compositions using the sameSHINETSU CHEMICAL CO·Filed 1998·Granted Oct 31, 2000·70 cites·10 claims
- 0789US8017684B2Heat conductive silicone grease compositionsSHINETSU CHEMICAL CO·Filed 2006·Granted Sep 13, 2011·11 cites·8 claims
- 0884US7786056B2Heat dissipating silicone grease compositionsSHINETSU CHEMICAL CO·Filed 2008·Granted Aug 31, 2010·5 cites·20 claims
- 0983US7838117B2Silicone-sealed LEDSHINETSU CHEMICAL CO·Filed 2006·Granted Nov 23, 2010·5 cites·12 claims
- 1079US8119758B2Heat-conductive silicone composition and cured product thereofSAKURAI IKUO·Filed 2007·Granted Feb 21, 2012·13 cites·8 claims
- 1179US5371116AVulcanizable organopolysiloxane compositionSHINETSU CHEMICAL CO·Filed 1993·Granted Dec 6, 1994·24 cites·10 claims
- 1277US8592030B2Silicone adhesive for semiconductor elementSHINETSU CHEMICAL CO·Filed 2013·Granted Nov 26, 2013·2 cites·20 claims
- 1377US5900438AThermosetting foamable organopolysiloxane composition and process of curing the sameSHINETSU CHEMICAL CO·Filed 1998·Granted May 4, 1999·36 cites·8 claims
- 1475US7951891B2Silicone resin composition for die bondingSHINETSU CHEMICAL CO·Filed 2006·Granted May 31, 2011·3 cites·17 claims
- 1575US6372860B1Mother mold-forming silicone rubber composition and mother moldSHINETSU CHEMICAL CO·Filed 2000·Granted Apr 16, 2002·13 cites·5 claims
- 1663US5561184ARoom temperature curable silicone compositionSHINETSU CHEMICAL CO·Filed 1994·Granted Oct 1, 1996·18 cites·6 claims
- 1761US6040361AOrganopolysiloxane compositionsSHINETSU CHEMICAL CO·Filed 1998·Granted Mar 21, 2000·16 cites·20 claims
- 1861US5514741ARoom temperature curable organopolysiloxane compositionSHINETSU CHEMICAL CO·Filed 1994·Granted May 7, 1996·12 cites·5 claims
- 1960US5482992ARoom temperature quick curable organopolysiloxane composition excellent in water resistanceSHINETSU CHEMICAL CO·Filed 1994·Granted Jan 9, 1996·15 cites·10 claims
- 2055US2008260957A1Method for adhering a thermally-conductive silicone composition, a primer for adhering a thermally-conductive silicone composition and a method for manufacturing a bonded complex of a thermally-conductive silicone compositionYAMADA KUNIHIRO·Filed 2007·Application pending·0 cites
- 2153US2009258216A1Silicone adhesive for semiconductor elementSHINETSU CHEMICAL CO·Filed 2009·Application pending·0 cites
- 2252US6008290AMildew resistant organopolysiloxane with hydrolyzable organosilane and triazolyl compoundSHINETSU CHEMICAL CO·Filed 1996·Granted Dec 28, 1999·11 cites·10 claims
- 2352US5196477ASilcone compositions comprising organic compounds having the capabilities of coordination with metalsSHINETSU CHEMICAL CO·Filed 1990·Granted Mar 23, 1993·8 cites·12 claims
- 2449US2007042533A1Heat conductive silicone grease composition and cured product thereofSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 2547US2008213578A1Heat conductive silicone grease composition and cured product thereofSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 2646US5508459A2-methyldialkoxysilyl propionic acid esterSHINETSU CHEMICAL CO·Filed 1995·Granted Apr 16, 1996·3 cites·9 claims
- 2745US5216037ARoom temperature vulcanizable, foamable polysiloxane compositionSHINETSU CHEMICAL CO·Filed 1992·Granted Jun 1, 1993·8 cites·13 claims
- 2845US2008099139A1Method for sealing microcomponentSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 2945US2004242762A1RTV heat conductive silicone rubber compositionsFiled 2004·Application pending·0 cites
- 3044US2007293624A1Heat conductive silicone grease compositionSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 3144US2007224800A1Production method for semiconductor deviceSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 3244US2007290202A1Organosilicon compoundSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 3341US2006079634A1RTV heat conductive silicone rubber compositionsSHINETSU CHEMICAL CO·Filed 2005·Application pending·0 cites
- 3438US5286892A2-trimethoxysilylpropionateSHINETSU CHEMICAL CO·Filed 1992·Granted Feb 15, 1994·1 cites·1 claims
- 3538US2004116640A1Silicone resin composition for LED devicesFiled 2003·Application pending·0 cites
- 3636US8609886B2Method for producing high purity terminal olefin compoundMIYOSHI KEI·Filed 2010·Granted Dec 17, 2013·0 cites·7 claims
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