Inventor · disambiguated record
Masashige Moritoki
Also filed as: MORITOKI MASASHIGE
12 granted patents·5 pending applications·27 citations·filing 1997–2023
86Inventor score
Files withRENESAS ELECTRONICS CORP7NEC ELECTRONICS CORP4SONY SEMICONDUCTOR SOLUTIONS CORP3MORITOKI MASASHIGE2NEC CORP1
Top patents by PatentIndex Score
17 records- 0179US9660079B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted May 23, 2017·2 cites·12 claims
- 0276US12339334B2Magnetoresistive element and semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Jun 24, 2025·1 cites·11 claims
- 0376US9478547B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Oct 25, 2016·3 cites·9 claims
- 0474US9064889B2Semiconductor device with epitaxial semiconductor layer for source/drain on substrate, and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Jun 23, 2015·2 cites·4 claims
- 0563US8455925B2Semiconductor device and method for manufacturing the sameMORITOKI MASASHIGE·Filed 2011·Granted Jun 4, 2013·3 cites·17 claims
- 0661US7879680B2Method of fabricating semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Feb 1, 2011·1 cites·20 claims
- 0759US7947568B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted May 24, 2011·1 cites·13 claims
- 0855US2025185399A1Solid-state imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 0953US9293562B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Mar 22, 2016·0 cites·14 claims
- 1051US7786005B2Method for manufacturing semiconductor device to form a via holeNEC ELECTRONICS CORP·Filed 2006·Granted Aug 31, 2010·1 cites·16 claims
- 1146US2008214008A1Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1246US2009297986A1Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1342US8143152B2Manufacturing method of semiconductor device having self-aligned contact connected to silicide layer on substrate surfaceMORITOKI MASASHIGE·Filed 2009·Granted Mar 27, 2012·0 cites·7 claims
- 1442US5759751AMethod of peeling photo-resist layer without damage to metal wiringNEC CORP·Filed 1997·Granted Jun 2, 1998·13 cites·14 claims
- 1538US2023079435A1Memory cell and memory cell arraySONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 1636US7646096B2Semiconductor device and manufacturing method thereofNEC ELECTRONICS CORP·Filed 2005·Granted Jan 12, 2010·0 cites·20 claims
- 1733US2015348973A1Semiconductor integrated circuit (ic) device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →