Inventor · disambiguated record
Yip Seng Low
Also filed as: LOW YIP SENG
9 granted patents·7 pending applications·27 citations·filing 2007–2016
84Inventor score
Technology areasH10W
Files withTOPACIO RODEN R6ATI TECHNOLOGIES ULC2LEUNG ANDREW K W2ADVANCED MICRO DEVICES INC1LEUNG ANDREW1
Top patents by PatentIndex Score
16 records- 0186US8298945B2Method of manufacturing substrates having asymmetric buildup layersLEUNG ANDREW·Filed 2011·Granted Oct 30, 2012·9 cites·14 claims
- 0275US11335659B2Semiconductor chip with patterned underbump metallization and polymer filmATI TECHNOLOGIES ULC·Filed 2016·Granted May 17, 2022·2 cites·20 claims
- 0371US8637983B2Face-to-face (F2F) hybrid structure for an integrated circuitMARTINEZ LIANE·Filed 2008·Granted Jan 28, 2014·6 cites·13 claims
- 0469US9576923B2Semiconductor chip with patterned underbump metallization and polymer filmTOPACIO RODEN R·Filed 2014·Granted Feb 21, 2017·2 cites·15 claims
- 0566US7906424B2Conductor bump method and apparatusADVANCED MICRO DEVICES INC·Filed 2007·Granted Mar 15, 2011·3 cites·18 claims
- 0665US9793199B2Circuit board with via trace connection and method of making the sameLEUNG ANDREW K W·Filed 2009·Granted Oct 17, 2017·3 cites·16 claims
- 0761US8772083B2Solder mask with anchor structuresLEUNG ANDREW K W·Filed 2011·Granted Jul 8, 2014·2 cites·12 claims
- 0850US2011024898A1Method of manufacturing substrates having asymmetric buildup layersATI TECHNOLOGIES ULC·Filed 2009·Application pending·0 cites
- 0947US8294266B2Conductor bump method and apparatusTOPACIO RODEN R·Filed 2011·Granted Oct 23, 2012·0 cites·15 claims
- 1046US2011057307A1Semiconductor Chip with Stair Arrangement Bump StructuresTOPACIO RODEN R·Filed 2009·Application pending·0 cites
- 1145US2012120615A1Circuit board with via trace connection and method of making the sameLEUNG ANDREW KW·Filed 2012·Application pending·0 cites
- 1242US8564122B2Circuit board component shim structureMCLELLAN NEIL R·Filed 2011·Granted Oct 22, 2013·0 cites·24 claims
- 1342US2010102457A1Hybrid Semiconductor Chip PackageTOPACIO RODEN R·Filed 2008·Application pending·0 cites
- 1440US2013258610A1Semiconductor chip device with vented lidLI JIANGUO·Filed 2012·Application pending·0 cites
- 1539US2013113084A1Semiconductor substrate with molded support layerTOPACIO RODEN R·Filed 2011·Application pending·0 cites
- 1638US2013147026A1Heatsink interposerTOPACIO RODEN R·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →