Inventor · disambiguated record
Y. Mohammed Kasem
Also filed as: KASEM Y MOHAMMED
20 granted patents·2 pending applications·981 citations·filing 1995–2011
96Inventor score
Top patents by PatentIndex Score
22 records- 0196US6562647B2Chip scale surface mount package for semiconductor device and process of fabricating the sameVISHAY INTERTECHNOLOGY INC·Filed 2001·Granted May 13, 2003·130 cites·37 claims
- 0296US6392290B1Vertical structure for semiconductor wafer-level chip scale packagesSILICONIX INC·Filed 2000·Granted May 21, 2002·171 cites·23 claims
- 0393US6249041B1IC chip package with directly connected leadsSILICONIX INC·Filed 1998·Granted Jun 19, 2001·196 cites·13 claims
- 0492US8324711B2Precision high-frequency capacitor formed on semiconductor substrateGOLDBERGER HAIM·Filed 2011·Granted Dec 4, 2012·12 cites·18 claims
- 0591US7211877B1Chip scale surface mount package for semiconductor device and process of fabricating the sameVISHAY SILICONIX·Filed 2005·Granted May 1, 2007·19 cites·6 claims
- 0687US6538300B1Precision high-frequency capacitor formed on semiconductor substrateVISHAY INTERTECHNOLOGY INC·Filed 2000·Granted Mar 25, 2003·39 cites·10 claims
- 0787US6316287B1Chip scale surface mount packages for semiconductor device and process of fabricating the sameVISHAY INTERTECHNOLOGY INC·Filed 1999·Granted Nov 13, 2001·90 cites·43 claims
- 0886US6876061B2Chip scale surface mount package for semiconductor device and process of fabricating the sameVISHAY INTERTECHNOLOGY INC·Filed 2002·Granted Apr 5, 2005·37 cites·22 claims
- 0986US6271060B1Process of fabricating a chip scale surface mount package for semiconductor deviceVISHAY INTERTECHNOLOGY INC·Filed 1999·Granted Aug 7, 2001·74 cites·35 claims
- 1085US6744124B1Semiconductor die package including cup-shaped leadframeSILICONIX INC·Filed 1999·Granted Jun 1, 2004·75 cites·9 claims
- 1180US6441475B2Chip scale surface mount package for semiconductor device and process of fabricating the sameVISHAY INTERTECHNOLOGY INC·Filed 2000·Granted Aug 27, 2002·26 cites·26 claims
- 1277US8004063B2Precision high-frequency capacitor formed on semiconductor substrateVISHAY INTERTECHNOLOGY INC·Filed 2006·Granted Aug 23, 2011·6 cites·18 claims
- 1376US6066890ASeparate circuit devices in an intra-package configuration and assembly techniquesSILICONIX INC·Filed 1995·Granted May 23, 2000·53 cites·31 claims
- 1473US7589396B2Chip scale surface mount package for semiconductor device and process of fabricating the sameVISHAY SILICONIX·Filed 2007·Granted Sep 15, 2009·4 cites·14 claims
- 1571US9136060B2Precision high-frequency capacitor formed on semiconductor substrateGOLDBERGER HAIM·Filed 2007·Granted Sep 15, 2015·4 cites·18 claims
- 1669US6621143B2Precision high-frequency capacitor on semiconductor substrateVISHAY INTERTECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·12 cites·5 claims
- 1769US6621142B2Precision high-frequency capacitor formed on semiconductor substrateVISHAY INTERTECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·12 cites·14 claims
- 1866US7151036B1Precision high-frequency capacitor formed on semiconductor substrateVISHAY SILICONIX·Filed 2003·Granted Dec 19, 2006·15 cites·7 claims
- 1955US6909170B2Semiconductor assembly with package using cup-shaped lead-frameSILICONIX INC·Filed 2002·Granted Jun 21, 2005·6 cites·8 claims
- 2054US2009278179A1Chip scale surface mount package for semiconductor device and process of fabricating the sameVISHAY SILICONIX·Filed 2009·Application pending·0 cites
- 2146US7595547B1Semiconductor die package including cup-shaped leadframeVISHAY SILICONIX·Filed 2005·Granted Sep 29, 2009·0 cites·10 claims
- 2231US2001009298A1Chip scale surface mount packages for semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →