Inventor · disambiguated record
Jae Sung Oh
Also filed as: OH JAE SUNG
7 granted patents·1 pending application·93 citations·filing 1998–2014
84Inventor score
Top patents by PatentIndex Score
8 records- 0194US8823158B2Semiconductor package and stacked semiconductor package having the sameSK HYNIX INC·Filed 2012·Granted Sep 2, 2014·27 cites·6 claims
- 0281US8299591B2Semiconductor package and stacked semiconductor package having the sameOH JAE SUNG·Filed 2008·Granted Oct 30, 2012·10 cites·4 claims
- 0373US9070691B2Semiconductor package and stacked semiconductor package having the sameSK HYNIX INC·Filed 2014·Granted Jun 30, 2015·2 cites·2 claims
- 0471US9030009B2Stacked semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2013·Granted May 12, 2015·4 cites·11 claims
- 0564US6032255AMethod for booting a personal digital assistantSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 29, 2000·47 cites·6 claims
- 0659US8024857B2Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 27, 2011·3 cites·27 claims
- 0742US7732903B2High capacity memory module using flexible substrateHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Jun 8, 2010·0 cites·13 claims
- 0840US2014014958A1Semiconductor chip module and semiconductor package having the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →