Inventor · disambiguated record
Xiaoyun Wei
Also filed as: WEI XIAOYUN
5 granted patents·2 pending applications·0 citations·filing 2017–2025
58Inventor score
Top patents by PatentIndex Score
7 records- 0158US11862529B2Chip and manufacturing method thereof, and electronic deviceHUAWEI TECH CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·19 claims
- 0257US2025189699A1Optical module housing and manufacturing method thereof, optical module, and optical communication deviceHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 0356US12341116B2Chip package structure, preparation method, and electronic deviceHUAWEI TECH CO LTD·Filed 2021·Granted Jun 24, 2025·0 cites·16 claims
- 0453US11776820B2Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging methodHUAWEI TECH CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·17 claims
- 0551US12472684B2Three-dimensional forming method and systemREGENOVO BIOTECHNOLOGY CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·6 claims
- 0650US2024085757A1Optical Phased Board, Manufacturing Method, and Optical Phased Array SystemHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 0735US11322701B2High dielectric constant composite material and application thereofUNIV PEKING SHENZHEN GRADUATE SCHOOL·Filed 2017·Granted May 3, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →