Inventor · disambiguated record
Stefan Miethaner
Also filed as: MIETHANER STEFAN
11 granted patents·142 citations·filing 2001–2023
87Inventor score
Files withINFINEON TECHNOLOGIES AG11
Top patents by PatentIndex Score
11 records- 0195US6458603B1Method of fabricating a micro-technical structure, and micro-technical componentINFINEON TECHNOLOGIES AG·Filed 2001·Granted Oct 1, 2002·104 cites·9 claims
- 0282US10566309B2Multi-purpose non-linear semiconductor package assembly lineINFINEON TECHNOLOGIES AG·Filed 2016·Granted Feb 18, 2020·3 cites·25 claims
- 0379US6574138B2Memory cell configuration and method for operating the configurationINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 3, 2003·28 cites·10 claims
- 0474US12288727B2Method of manufacturing a package having an adhesion promoterINFINEON TECHNOLOGIES AG·Filed 2023·Granted Apr 29, 2025·0 cites·15 claims
- 0568US11652084B2Flat lead package formation methodINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 16, 2023·0 cites·6 claims
- 0664US11652012B2Inorganic encapsulant for electronic component with adhesion promoterINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 16, 2023·0 cites·17 claims
- 0764US10497587B1Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materialsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 3, 2019·1 cites·19 claims
- 0862US11302668B2Multi-purpose non-linear semiconductor package assembly lineINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 12, 2022·0 cites·10 claims
- 0954US11069626B2Molding compound and semiconductor package with a molding compoundINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 1043US6943393B2Memory cell arrangement and method of fabricating itINFINEON TECHNOLOGIES AG·Filed 2001·Granted Sep 13, 2005·4 cites·8 claims
- 1138US7408803B2Method for writing to magnetoresistive memory cells and magnetoresistive memory which can be written to by the methodINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 5, 2008·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →