Inventor · disambiguated record
Junghoo Shin
Also filed as: SHIN JUNGHOO
7 granted patents·3 pending applications·3 citations·filing 2020–2024
71Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0188US11069613B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 20, 2021·3 cites·20 claims
- 0275US2024395613A1Method of forming interconnect structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0373US2025014998A1Semiconductor integrated circuit device suppressing leakage current of multilayer wiring structuresSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0469US12080595B2Method of forming interconnect structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·25 claims
- 0564US12125785B2Semiconductor integrated circuit device suppressing leakage current of multilayer wiring structuresSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 0658US12469788B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 0757US12400975B2Interconnect structure and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 26, 2025·0 cites·22 claims
- 0853US12315792B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 0953US11721622B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 1053US2024162323A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →