Inventor · disambiguated record
Toshinao Shinbo
Also filed as: SHINBO TOSHINAO
9 granted patents·23 citations·filing 2002–2020
83Inventor score
Files withSEIKO EPSON CORP9
Top patents by PatentIndex Score
9 records- 0181US11273642B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2020·Granted Mar 15, 2022·1 cites·12 claims
- 0273US7320163B2Method of manufacturing an actuator deviceSEIKO EPSON CORP·Filed 2005·Granted Jan 22, 2008·4 cites·7 claims
- 0365US7579041B2Method of manufacturing dielectric layer and method of manufacturing liquid jet headSEIKO EPSON CORP·Filed 2004·Granted Aug 25, 2009·6 cites·8 claims
- 0463US8003161B2Method of manufacturing dielectric layer and method of manufacturing liquid jet headSEIKO EPSON CORP·Filed 2008·Granted Aug 23, 2011·0 cites·3 claims
- 0559US7562451B2Method of manufacturing actuator device for ink jet headSEIKO EPSON CORP·Filed 2004·Granted Jul 21, 2009·7 cites·9 claims
- 0654US10926538B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2019·Granted Feb 23, 2021·0 cites·16 claims
- 0751US6878609B2Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break patternSEIKO EPSON CORP·Filed 2003·Granted Apr 12, 2005·4 cites·20 claims
- 0847US7992972B2Method of manufacturing liquid jet head, method of manufacturing piezoelectric element and liquid jet apparatusSEIKO EPSON CORP·Filed 2009·Granted Aug 9, 2011·0 cites·7 claims
- 0943US6699552B2Silicon wafer break pattern, silicon substrateSEIKO EPSON CORP·Filed 2002·Granted Mar 2, 2004·1 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →