Inventor · disambiguated record
Sheng-Pin Yang
Also filed as: YANG SHENG · YANG SHENG PIN
12 granted patents·5 pending applications·9 citations·filing 2015–2024
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10TEXAS INSTRUMENTS INC570MAI CO LTD1TAIWAN SEMICONDUCTOR MANUFACATURING CO LTD1
Top patents by PatentIndex Score
17 records- 0195US11855028B2Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 0282US10163849B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 0378US2024379605A1Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MANUFACATURING CO LTD·Filed 2024·Application pending·0 cites
- 0477US12412857B2Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 0577US12347722B2Semiconductor device structure with a protection cap at an end portion of a conductive lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0675US11557508B2Semiconductor device structure having protection caps on conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 17, 2023·0 cites·20 claims
- 0775US10269703B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 0874US10249504B2Etching and mechanical grinding film-layers stacked on a semiconductor substrateTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 2, 2019·2 cites·20 claims
- 0970US11069652B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
- 1063US10535629B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
- 1158US2024429290A1Nexfet ngen3.2 mv dual shield oxide damage solutionTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1257US10748810B2Method of manufacturing an integrated inductor with protections caps on conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·20 claims
- 1356US2024361699A1Monitor structure for photoresist thickness in trenchTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1454US10566204B2Etching and mechanical grinding film-layers stacked on a semiconductor substrateTEXAS INSTRUMENTS INC·Filed 2019·Granted Feb 18, 2020·0 cites·15 claims
- 1554US9799625B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·20 claims
- 1653US2024113217A1Trench shielded transistorTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1747US2025350825A1Recording method and device by using low-power-consumption recording system70MAI CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →