Inventor · disambiguated record
Ming-Kun Yang
Also filed as: YANG MING · Yang ming-kun
5 granted patents·4 pending applications·5 citations·filing 2011–2021
63Inventor score
Top patents by PatentIndex Score
9 records- 0177US9559001B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Jan 31, 2017·5 cites·21 claims
- 0246US11456950B2Data forwarding unit based on handle identifierSHENYANG INST AUTOMATION CAS·Filed 2019·Granted Sep 27, 2022·0 cites·10 claims
- 0344US2025028981A1Interface Display Method and Apparatus of Industrial SoftwareSIEMENS AG·Filed 2021·Application pending·0 cites
- 0437US10447655B2Method for controlling transmission security of industrial communications flow based on SDN architectureSHENYANG INST AUTOMATION CAS·Filed 2015·Granted Oct 15, 2019·0 cites·20 claims
- 0535US8692300B2Interposer and method for forming the sameYang ming-kun·Filed 2012·Granted Apr 8, 2014·0 cites·20 claims
- 0633US9711403B2Method for forming chip packageCHEN CHIEN-HUI·Filed 2012·Granted Jul 18, 2017·0 cites·20 claims
- 0730US2011291153A1Chip submount, chip package, and fabrication method thereofYang ming-kun·Filed 2011·Application pending·0 cites
- 0830US2012080706A1Chip package and method for forming the sameYang ming-kun·Filed 2011·Application pending·0 cites
- 0930US2012104445A1Chip package and method for forming the sameYang ming-kun·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →