Inventor · disambiguated record
Chee-Way Oh
Also filed as: OH CHEE-WAY
2 granted patents·0 citations·filing 2009–2011
28Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0150US8033039B2High frequency flip chip package process of polymer substrate and structure thereofUNIV NAT CHIAO TUNG·Filed 2009·Granted Oct 11, 2011·0 cites·7 claims
- 0246US8258606B2High frequency flip chip package structure of polymer substrateCHANG EDWARD-YI·Filed 2011·Granted Sep 4, 2012·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →