Inventor · disambiguated record
Charles T. Eytcheson
Also filed as: EYTCHESON CHARLES T · EYTCHESON CHARLES TYLER
17 granted patents·1 pending application·717 citations·filing 1978–2004
96Inventor score
Top patents by PatentIndex Score
18 records- 0186US5539254ASubstrate subassembly for a transistor switch moduleDELCO ELECTRONICS CORP·Filed 1994·Granted Jul 23, 1996·92 cites·9 claims
- 0285US5563447AHigh power semiconductor switch moduleDELCO ELECTRONICS CORP·Filed 1993·Granted Oct 8, 1996·90 cites·31 claims
- 0383US6054765AParallel dual switch moduleDELCO ELECTRONICS CORP·Filed 1998·Granted Apr 25, 2000·87 cites·14 claims
- 0480US5492842ASubstrate subassembly and method of making transistor switch moduleDELCO ELECTRONICS CORP·Filed 1995·Granted Feb 20, 1996·62 cites·8 claims
- 0579US5444295ALinear dual switch moduleDELCO ELECTRONICS CORP·Filed 1993·Granted Aug 22, 1995·65 cites·37 claims
- 0678US6127727ASemiconductor substrate subassembly with alignment and stress relief featuresDELCO ELECTRONICS CORP·Filed 1998·Granted Oct 3, 2000·57 cites·5 claims
- 0778US5895974ADurable substrate subassembly for transistor switch moduleDELCO ELECTRONICS CORP·Filed 1998·Granted Apr 20, 1999·62 cites·18 claims
- 0872US6822331B2Method of mounting a circuit component and joint structure thereforDELPHI TECH INC·Filed 2001·Granted Nov 23, 2004·16 cites·36 claims
- 0969US5523620ACoplanar linear dual switch moduleDELCO ELECTRONICS CORP·Filed 1994·Granted Jun 4, 1996·46 cites·18 claims
- 1064US4215360APower semiconductor device assembly having a lead frame with interlock membersGEN MOTORS CORP·Filed 1978·Granted Jul 29, 1980·22 cites·7 claims
- 1160US5519253ACoaxial switch moduleDELCO ELECTRONICS CORP·Filed 1993·Granted May 21, 1996·29 cites·39 claims
- 1255US6918437B2Heatsink buffer configurationDELPHI TECH INC·Filed 2002·Granted Jul 19, 2005·10 cites·4 claims
- 1350US5517059AElectron and laser beam welding apparatusDELCO ELECTRONICS CORP·Filed 1994·Granted May 14, 1996·23 cites·10 claims
- 1447US4490902ALead frame for molded integrated circuit packageGEN MOTORS CORP·Filed 1982·Granted Jan 1, 1985·16 cites·2 claims
- 1545US5322565AMethod and apparatus for through hole substrate printingDELCO ELECTRONICS CORP·Filed 1991·Granted Jun 21, 1994·17 cites·5 claims
- 1642US5072281AInterconnection lead having individual spiral lead designDELCO ELECTRONICS CORP·Filed 1991·Granted Dec 10, 1991·12 cites·11 claims
- 1742US2005093115A1Method of mounting a circuit component and joint structure thereforDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 1838US5080929AMethod and apparatus for through hole substrate printingDELCO ELECTRONICS CORP·Filed 1990·Granted Jan 14, 1992·11 cites·4 claims
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