Inventor · disambiguated record
Toshio Haba
Also filed as: HABA TOSHIO
5 granted patents·11 pending applications·85 citations·filing 1999–2011
79Inventor score
Top patents by PatentIndex Score
16 records- 0184US8387255B2Fine pattern moldOGINO MASAHIKO·Filed 2011·Granted Mar 5, 2013·7 cites·3 claims
- 0281US6300244B1Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Oct 9, 2001·57 cites·18 claims
- 0374US6511588B1Plating method using an additiveHITACHI LTD·Filed 2000·Granted Jan 28, 2003·19 cites·7 claims
- 0472US8083515B2Fine pattern moldOGINO MASAHIKO·Filed 2008·Granted Dec 27, 2011·2 cites·8 claims
- 0557US2009057156A1Production method for wiring and viasHITACHI CABLE·Filed 2008·Application pending·0 cites
- 0653US7922887B2Metal structure and method of its productionHITACHI LTD·Filed 2006·Granted Apr 12, 2011·0 cites·28 claims
- 0751US2011114368A1Electronic circuit component and method for manufacturing sameNAKANO HIROSHI·Filed 2009·Application pending·0 cites
- 0850US2008251387A1Wiring Board and Production Method ThereofHABA TOSHIO·Filed 2008·Application pending·0 cites
- 0946US2002084191A1Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using sameFiled 2001·Application pending·0 cites
- 1045US2006163725A1Wiring board and production method thereofHABA TOSHIO·Filed 2005·Application pending·0 cites
- 1144US2007287289A1Production method of conductive patternHABA TOSHIO·Filed 2007·Application pending·0 cites
- 1243US2005087447A1Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using sameFiled 2004·Application pending·0 cites
- 1342US2011143196A1Lithium secondary batteryHITACHI VEHICLE ENERGY LTD·Filed 2010·Application pending·0 cites
- 1442US2010181100A1Copper circuit wiring board and method for manufacturing the sameHITACHI CABLE·Filed 2010·Application pending·0 cites
- 1539US2003085467A1Plating method, plating solution, semiconductor device and process for producing the sameFiled 2002·Application pending·0 cites
- 1637US2002030283A1Semiconductor device having wires and insulator layers with via-studsFiled 2001·Application pending·0 cites
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