Inventor · disambiguated record
Teruhisa Fujihara
Also filed as: FUJIHARA TERUHISA
5 granted patents·50 citations·filing 1998–2001
79Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP5
Top patents by PatentIndex Score
5 records- 0158US6163069ASemiconductor device having pads for connecting a semiconducting element to a mother boardMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 19, 2000·27 cites·7 claims
- 0255US6787389B1Semiconductor device having pads for connecting a semiconducting element to a mother boardMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 7, 2004·9 cites·7 claims
- 0350US6372546B2Method of producing semiconductor device and configuration thereof, and lead frame used in said methodMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 16, 2002·5 cites·7 claims
- 0437US6462406B2Semiconductor device and lead frameMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 8, 2002·8 cites·7 claims
- 0528US6252306B1Method of producing semiconductor device and configuration thereof, and lead frame used in said methodMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 26, 2001·1 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →