Inventor · disambiguated record
Jeonghoon Ahn
Also filed as: AHN JEONGHOON
6 granted patents·6 pending applications·5 citations·filing 2019–2024
71Inventor score
Top patents by PatentIndex Score
12 records- 0189US12107034B2Semiconductor chip and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 1, 2024·2 cites·20 claims
- 0279US11094624B2Semiconductor device having capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 17, 2021·3 cites·13 claims
- 0368US12408355B2Metal-insulator-metal capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·15 claims
- 0468US2024395672A1Semiconductor chip and semiconductor package including sameNAME SAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0566US2025061262A1Method of designing interconnect structure of semiconductor apparatus and method of manufacturing semiconductor apparatus using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0658US11955509B2Metal-insulator-metal capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·7 claims
- 0756US12159095B2Method of designing interconnect structure of semiconductor apparatus and method of manufacturing semiconductor apparatus using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 0856US2024178131A1Semiconductor device having through-via structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0952US2024071924A1Integrated circuit device including interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1049US11429777B2Methods of estimating warpage of interposers and methods of manufacturing semiconductor package by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 30, 2022·0 cites·20 claims
- 1149US2023148222A1Interposer structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1245US2023030589A1Semiconductor package including chip connection structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →