Inventor · disambiguated record
Job Ha
Also filed as: HA JOB
10 granted patents·8 pending applications·151 citations·filing 2008–2020
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
18 records- 0190USD717254SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·50 cites·1 claims
- 0289USD717253SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·44 cites·1 claims
- 0388USD717256SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·43 cites·1 claims
- 0477US10559541B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 11, 2020·2 cites·20 claims
- 0577US9455207B2All-in-one power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 27, 2016·4 cites·9 claims
- 0670US11227835B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 18, 2022·2 cites·19 claims
- 0770US10811358B2Hybrid interposer and semiconductor package including the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 20, 2020·2 cites·20 claims
- 0868US9099451B2Power module package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 4, 2015·2 cites·16 claims
- 0963US7911043B2Wafer level device package with sealing line having electroconductive pattern and method of packaging the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 22, 2011·2 cites·16 claims
- 1059US10854561B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 1, 2020·0 cites·20 claims
- 1145US2008283989A1Wafer level package and wafer level packaging methodSAMSUNG ELECTRO MECANICS CO LT·Filed 2008·Application pending·0 cites
- 1243US2015228567A1Package substrate and semiconductor package using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1343US2015145123A1Power semiconductor module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1442US2014138839A1Power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1539US2014001613A1Semiconductor packageHA JOB·Filed 2012·Application pending·0 cites
- 1638US2013147027A1Semiconductor packageHA JOB·Filed 2012·Application pending·0 cites
- 1738US2013134569A1Semiconductor packageHA JOB·Filed 2012·Application pending·0 cites
- 1838US2013285232A1Semiconductor package moduleHA JOB·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →