Inventor · disambiguated record
Chih-Jen Wu
Also filed as: WU CHIH-JEN
25 granted patents·2 pending applications·152 citations·filing 2001–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG7HUANG KUAN-CHIEH5TAIWAN SEMICONDUCTOR MFG CO LTD4E INK HOLDINGS INC2TU AN-CHUN2
Top patents by PatentIndex Score
27 records- 0197US8247262B2Method for reducing contact resistance of CMOS image sensorHUANG KUAN-CHIEH·Filed 2010·Granted Aug 21, 2012·65 cites·20 claims
- 0293US10357867B2Polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 23, 2019·8 cites·20 claims
- 0393US8586404B2Method for reducing contact resistance of CMOS image sensorHUANG KUAN-CHIEH·Filed 2012·Granted Nov 19, 2013·15 cites·20 claims
- 0486US8674469B2Isolation structure for backside illuminated image sensorHUANG KUAN-CHIEH·Filed 2010·Granted Mar 18, 2014·7 cites·18 claims
- 0584US8704224B2Semiconductor test structuresTU AN-CHUN·Filed 2011·Granted Apr 22, 2014·5 cites·13 claims
- 0683US8116928B2Automatic ultrasonic and computer-vision navigation device and method using the sameWU CHIH-JEN·Filed 2009·Granted Feb 14, 2012·31 cites·28 claims
- 0782US9718164B2Polishing system and polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 1, 2017·4 cites·20 claims
- 0876US8791541B2Backside-illuminated image sensor having a supporting substrateHUANG KUAN-CHIEH·Filed 2012·Granted Jul 29, 2014·2 cites·19 claims
- 0969US8605276B2Enhanced defect scanningWU CHIH-JEN·Filed 2011·Granted Dec 10, 2013·2 cites·18 claims
- 1068US9250286B2Semiconductor test structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·1 cites·20 claims
- 1164US11358252B2Method of using a polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·20 claims
- 1261US9978298B2Display panel and driving method thereofE INK HOLDINGS INC·Filed 2015·Granted May 22, 2018·1 cites·29 claims
- 1359US11581751B2Power control method and related charging systemWISTRON CORP·Filed 2020·Granted Feb 14, 2023·0 cites·14 claims
- 1459US8283745B2Method of fabricating backside-illuminated image sensorHUANG KUAN-CHIEH·Filed 2009·Granted Oct 9, 2012·0 cites·7 claims
- 1559US2025364480A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1658US9257326B2Method of making backside illuminated image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 9, 2016·0 cites·20 claims
- 1758US8952474B2Method of fabricating backside-illuminated image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
- 1858US6569784B1Material of photoresist protect oxideTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted May 27, 2003·11 cites·19 claims
- 1956US9377503B2Semiconductor test structuresTU AN-CHUN·Filed 2014·Granted Jun 28, 2016·0 cites·20 claims
- 2056US8946847B2Backside illuminated image sensors and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 3, 2015·0 cites·20 claims
- 2151US8352062B2Advanced process control for gate profile controlTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jan 8, 2013·0 cites·20 claims
- 2245US8796105B2Method and apparatus for preparing polysilazane on a semiconductor waferCHOU YOU-HUA·Filed 2012·Granted Aug 5, 2014·0 cites·19 claims
- 2344US10431167B2Electronic paper display apparatus, signal transmission system and method thereofE INK HOLDINGS INC·Filed 2015·Granted Oct 1, 2019·0 cites·15 claims
- 2444US10384002B2Sensor patch, system, and method for detecting fluid leakageUNIV NAT TAIPEI TECHNOLOGY·Filed 2015·Granted Aug 20, 2019·0 cites·29 claims
- 2542US9330901B2Nitrogen-containing oxide film and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 3, 2016·0 cites·20 claims
- 2637US2012290404A1System and method for promoting multi-layer-forwarding messagesCHUANG KUO-YU·Filed 2012·Application pending·0 cites
- 2731US10525073B2Method for improving kidney and/or heart function in patients with kidney diseaseLIN CHENG JUI·Filed 2016·Granted Jan 7, 2020·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →