Inventor · disambiguated record
Junya Kusunoki
Also filed as: KUSUNOKI JUNYA
6 granted patents·7 pending applications·4 citations·filing 2005–2011
69Inventor score
Top patents by PatentIndex Score
13 records- 0175US8030425B2Photosensitive compositions based on polycyclic polymers for low stress, high temperature filmsPROMERUS LLC·Filed 2008·Granted Oct 4, 2011·3 cites·42 claims
- 0250US7999354B2Resin composition, filling material, insulating layer and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2008·Granted Aug 16, 2011·1 cites·17 claims
- 0345US7808083B2Semiconductor deviceSUMITOMO BAKELITE CO·Filed 2005·Granted Oct 5, 2010·0 cites·4 claims
- 0442US2010120937A1Semiconductor deviceSUMITOMO BAKELITE CO·Filed 2010·Application pending·0 cites
- 0539US7915467B2Semiconductor wafer and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2005·Granted Mar 29, 2011·0 cites·9 claims
- 0637US2009008682A1Light-Receiving DeviceKUSUNOKI JUNYA·Filed 2005·Application pending·0 cites
- 0736US2006228562A1Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulatingUKAWA KEN·Filed 2006·Application pending·0 cites
- 0835US2013009172A1Method of manufacture of light-emitting element and light-emitting element manufactured therebySUMITOMO BAKELITE CO·Filed 2011·Application pending·0 cites
- 0932US2006020068A1Photosensitive compositions based on polycyclic polymers for low stress, high temperature filmsELCE EDMUND·Filed 2005·Application pending·0 cites
- 1032US2012228782A1Method for manufacturing electronic device, electronic device, method for manufacturing electronic device package and electronic device packageKAWATA MASAKAZU·Filed 2010·Application pending·0 cites
- 1130US2011263095A1Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the sameSUMITOMO BAKELITE CO·Filed 2010·Application pending·0 cites
- 1228US8268540B2Method of manufacturing light receiving deviceTAKAHASHI TOYOSEI·Filed 2007·Granted Sep 18, 2012·0 cites·16 claims
- 1327US9399725B2Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the sameTAKEUCHI ETSU·Filed 2010·Granted Jul 26, 2016·0 cites·23 claims
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