Inventor · disambiguated record
Cary J. Baerlocher
Also filed as: BAERLOCHER CARY · BAERLOCHER CARY J
35 granted patents·2 pending applications·661 citations·filing 1999–2012
98Inventor score
Technology areasH10W
Top patents by PatentIndex Score
37 records- 0196US6329220B1Packages for semiconductor dieMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 11, 2001·161 cites·17 claims
- 0295US6778404B1Stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 17, 2004·75 cites·30 claims
- 0394US7026548B2Moisture-resistant electronic device package and methods of assemblyMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 11, 2006·22 cites·19 claims
- 0493US6365434B1Method and apparatus for reduced flash encapsulation of microelectronic devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 2, 2002·67 cites·54 claims
- 0591US6644949B2Apparatus for reduced flash encapsulation of microelectronic devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 11, 2003·51 cites·29 claims
- 0691US6638595B2Method and apparatus for reduced flash encapsulation of microelectronic devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 28, 2003·52 cites·13 claims
- 0787US6953891B2Moisture-resistant electronic device package and methods of assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 11, 2005·31 cites·48 claims
- 0884US8115296B2Electronic device packageBOLKEN TODD O·Filed 2009·Granted Feb 14, 2012·8 cites·22 claims
- 0983US7101730B2Method of manufacturing a stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 5, 2006·24 cites·32 claims
- 1082US7459773B2Stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 2, 2008·7 cites·13 claims
- 1182US7268067B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 11, 2007·21 cites·21 claims
- 1281US7276802B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 2, 2007·21 cites·27 claims
- 1379US7262074B2Methods of fabricating underfilled, encapsulated semiconductor die assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 28, 2007·21 cites·20 claims
- 1478US7468559B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 23, 2008·5 cites·23 claims
- 1576US6518654B1Packages for semiconductor dieMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 11, 2003·15 cites·19 claims
- 1673US8508034B2Electronic devicesBOLKEN TODD O·Filed 2012·Granted Aug 13, 2013·2 cites·20 claims
- 1771US7342319B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 11, 2008·3 cites·17 claims
- 1869US7091060B2Circuit and substrate encapsulation methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 15, 2006·10 cites·3 claims
- 1968US7851907B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 14, 2010·2 cites·20 claims
- 2068US6776599B2Method and apparatus for gate blocking X-outs during a molding processMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 17, 2004·11 cites·6 claims
- 2164US6523254B1Method for gate blocking x-outs during a molding processMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·9 cites·18 claims
- 2263US7239029B2Packages for semiconductor dieMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 3, 2007·7 cites·3 claims
- 2360US7095097B2Integrated circuit device having reduced bow and method for making sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 22, 2006·6 cites·26 claims
- 2459US7288431B2Molded stiffener for thin substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 30, 2007·1 cites·50 claims
- 2556US7144245B2Packages for semiconductor dieMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 5, 2006·4 cites·6 claims
- 2656US7019408B2Stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 28, 2006·4 cites·19 claims
- 2756US6791198B2Method and apparatus for gate blocking X-outs during a molding processMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 14, 2004·5 cites·4 claims
- 2855US6887740B2Method for making an integrated circuit package having reduced bowMICRON TECHNOLOGY INC·Filed 2003·Granted May 3, 2005·4 cites·21 claims
- 2954US8093730B2Underfilled semiconductor die assemblies and methods of forming the sameHALL FRANK L·Filed 2006·Granted Jan 10, 2012·1 cites·26 claims
- 3054US7116000B2Underfilled, encapsulated semiconductor die assemblies and methods of fabricationMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 3, 2006·4 cites·42 claims
- 3153US8148803B2Molded stiffener for thin substratesCOBBLEY CHAD A·Filed 2002·Granted Apr 3, 2012·4 cites·59 claims
- 3252US8716849B2Semiconductor device including one or more stiffening elementsCOBBLEY CHAD A·Filed 2012·Granted May 6, 2014·0 cites·21 claims
- 3352US6577018B1Integrated circuit device having reduced bow and method for making sameMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·3 cites·33 claims
- 3451US2006290011A1Molded stiffener for thin substratesMICRO TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 3550US7344921B2Integrated circuit device having reduced bow and method for making sameMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 18, 2008·0 cites·20 claims
- 3649US2006169490A1Molding tool and a method of forming an electronic device packageBOLKEN TODD O·Filed 2006·Application pending·0 cites
- 3743US7423331B2Molded stiffener for thin substratesMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 9, 2008·0 cites·39 claims
Join the waitlist — get patent alerts
Get an alert when Cary J. Baerlocher files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →