Inventor · disambiguated record
Tom Gregorich
Also filed as: GREGORICH TOM
2 granted patents·1 pending application·103 citations·filing 2003–2004
65Inventor score
Files withQUALCOMM INC2
Top patents by PatentIndex Score
3 records- 0192US6762495B1Area array package with non-electrically connected solder ballsQUALCOMM INC·Filed 2003·Granted Jul 13, 2004·98 cites·15 claims
- 0252US6891275B2Method for accommodating small minimum die in wire bonded area array packagesQUALCOMM INC·Filed 2003·Granted May 10, 2005·5 cites·12 claims
- 0336US2004195703A1Method for accommodating small minimum die in wire bonded area array packagesFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →