Inventor · disambiguated record
Stuart D. Downes
Also filed as: DOWNES STUART · DOWNES STUART D · DOWNES STUART DOUGLAS
23 granted patents·571 citations·filing 1995–2006
97Inventor score
Files withEMC CORP23
Top patents by PatentIndex Score
23 records- 0193US7084353B1Techniques for mounting a circuit board component to a circuit boardEMC CORP·Filed 2002·Granted Aug 1, 2006·67 cites·29 claims
- 0292US6347734B1Methods and apparatus for installing a module on a circuit board using heating and cooling techniquesEMC CORP·Filed 2000·Granted Feb 19, 2002·56 cites·31 claims
- 0390US6773269B1Circuit board assembly which utilizes a pin assembly and techniques for making the sameEMC CORP·Filed 2002·Granted Aug 10, 2004·48 cites·31 claims
- 0490US6179631B1Electrical contact for a printed circuit boardEMC CORP·Filed 1997·Granted Jan 30, 2001·82 cites·24 claims
- 0583US6552277B1Techniques for forming a connection between a pin and a circuit boardEMC CORP·Filed 2000·Granted Apr 22, 2003·29 cites·22 claims
- 0682US7155821B1Techniques for manufacturing a circuit board having a countersunk viaEMC CORP·Filed 2004·Granted Jan 2, 2007·38 cites·23 claims
- 0782US6222277B1Non-collapsing interconnection for semiconductor devicesEMC CORP·Filed 1999·Granted Apr 24, 2001·53 cites·11 claims
- 0880US7385472B1Multi-level printed circuit board interstitial viasEMC CORP·Filed 2006·Granted Jun 10, 2008·8 cites·10 claims
- 0979US6386435B1Systems and methods for distributing solder paste using a tool having a solder paste aperture with a non-circular cross-sectional shapeEMC CORP·Filed 2000·Granted May 14, 2002·19 cites·13 claims
- 1077US7416106B1Techniques for creating optimized pad geometries for solderingEMC CORP·Filed 2003·Granted Aug 26, 2008·21 cites·20 claims
- 1174US6736308B1Systems and methods for distributing solder paste using a tool having a solder paste aperture with a non-circular cross-sectional shapeEMC CORP·Filed 2002·Granted May 18, 2004·15 cites·19 claims
- 1274US6398935B1Method for manufacturing pcb'sEMC CORP·Filed 2000·Granted Jun 4, 2002·11 cites·22 claims
- 1368US7159758B1Circuit board processing techniques using solder fusingEMC CORP·Filed 2003·Granted Jan 9, 2007·13 cites·21 claims
- 1466US6716072B1Systems and methods for disposing a circuit board component on a circuit board using a soldering pinEMC CORP·Filed 2002·Granted Apr 6, 2004·15 cites·32 claims
- 1565US7252100B1Systems and methods for processing a set of circuit boardsEMC CORP·Filed 2003·Granted Aug 7, 2007·18 cites·15 claims
- 1662US6800545B2Micro soldered connectionEMC CORP·Filed 2002·Granted Oct 5, 2004·7 cites·13 claims
- 1761US6637641B1Systems and methods for manufacturing a circuit boardEMC CORP·Filed 2002·Granted Oct 28, 2003·8 cites·20 claims
- 1857US5589669AElectrical contact for printed circuit boardsEMC CORP·Filed 1995·Granted Dec 31, 1996·20 cites·17 claims
- 1956US6478604B1Methods and apparatus for forming an insulation displacement connectionEMC CORP·Filed 2001·Granted Nov 12, 2002·10 cites·23 claims
- 2053US6084397AVerification gauge for an electronic package lead inspection apparatusEMC CORP·Filed 1997·Granted Jul 4, 2000·14 cites·38 claims
- 2152US6483041B1Micro soldered connectionEMC CORP·Filed 1999·Granted Nov 19, 2002·12 cites·20 claims
- 2246US6544392B1Apparatus for manufacturing pcb'sEMC CORP·Filed 2002·Granted Apr 8, 2003·5 cites·6 claims
- 2345US6429645B1Verification gauge for an electronic package lead inspection apparatusEMC CORP·Filed 2000·Granted Aug 6, 2002·2 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →