Inventor · disambiguated record
Cao Minh Thai
Also filed as: THAI CAO M · THAI CAO MINH
9 granted patents·3 pending applications·246 citations·filing 1985–2004
89Inventor score
Top patents by PatentIndex Score
12 records- 0189US6225701B1Semiconductor device provided with heat-sink and method of manufacturing the sameTOSHIBA KK·Filed 2000·Granted May 1, 2001·65 cites·14 claims
- 0283US5536970AResin-encapsulated semiconductor deviceTOSHIBA KK·Filed 1994·Granted Jul 16, 1996·80 cites·22 claims
- 0376US4829134AEpoxy resin compositionTOSHIBA KK·Filed 1987·Granted May 9, 1989·24 cites·12 claims
- 0474US5589129AMethod of manufacturing a molding using a filler or an additive concentrated on an arbitrary portion or distributed at a gradient concentrationTOSHIBA KK·Filed 1995·Granted Dec 31, 1996·47 cites·18 claims
- 0573US6465531B1Method for recycling thermoset resin materialsTOSHIBA KK·Filed 2000·Granted Oct 15, 2002·15 cites·34 claims
- 0652US4617330AEpoxy resin composition for cast moldingTOSHIBA KK·Filed 1985·Granted Oct 14, 1986·10 cites·9 claims
- 0751US7141647B2Image file arrangement for use with an improved image quality assurance systemTOSHIBA KK·Filed 2004·Granted Nov 28, 2006·1 cites·21 claims
- 0848US7138435B2Method of decomposing thermosetting resin, apparatus and heat control programTOSHIBA KK·Filed 2001·Granted Nov 21, 2006·1 cites·17 claims
- 0948US6949814B2Mounting material, semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Sep 27, 2005·3 cites·12 claims
- 1043US2005010025A1Resin composition and manufacturing method thereofTOSHIBA KK·Filed 2004·Application pending·0 cites
- 1137US2004143085A1Method for processing urethane resin, decomposed substance of urethane resin, recycled resin and method for producing the sameTOSHIBA KK·Filed 2003·Application pending·0 cites
- 1236US2003229152A1Method of treating urethane resin, composition for recycling same, and regeneration methodTOSHIBA TOKYO JAPAN KK·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →