Inventor · disambiguated record
Hsiang-Ming Feng
Also filed as: FENG HSIANG-MING
9 granted patents·3 citations·filing 2008–2024
77Inventor score
Top patents by PatentIndex Score
9 records- 0177US12444689B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Oct 14, 2025·0 cites·4 claims
- 0265US8779581B2Heat dissipating semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Granted Jul 15, 2014·2 cites·12 claims
- 0364US11894308B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 6, 2024·0 cites·14 claims
- 0461US9054118B2Heat dissipating semiconductor device packages and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jun 9, 2015·1 cites·20 claims
- 0554US10854550B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 1, 2020·0 cites·22 claims
- 0641US8866311B2Semiconductor package substrates having pillars and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Oct 21, 2014·0 cites·19 claims
- 0740US8592962B2Semiconductor device packages with protective layer and related methodsCHEN KUANG-HSIUNG·Filed 2011·Granted Nov 26, 2013·0 cites·17 claims
- 0840US8053175B2Method of forming measuring targets for measuring dimensions of substrate in substrate manufacturing processASE ELECTRONCIS INC·Filed 2008·Granted Nov 8, 2011·0 cites·17 claims
- 0938US8686568B2Semiconductor package substrates having layered circuit segments, and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Apr 1, 2014·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Hsiang-Ming Feng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →