Inventor · disambiguated record

Hsing-Wen Lee

Also filed as: LEE HSING-WEN

3 granted patents·0 citations·filing 2018–2024

49Inventor score

Technology areasH10W

Files withADVANCED SEMICONDUCTOR ENG3

Top patents by PatentIndex Score

3 records

0177US12444689B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Oct 14, 2025·0 cites·4 claims
0264US11894308B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 6, 2024·0 cites·14 claims
0354US10854550B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 1, 2020·0 cites·22 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →