Inventor · disambiguated record
Fei Zong
Also filed as: ZONG FEI
5 granted patents·2 pending applications·8 citations·filing 2012–2015
69Inventor score
Top patents by PatentIndex Score
7 records- 0174US9362212B1Integrated circuit package having side and bottom contact padsFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 7, 2016·3 cites·17 claims
- 0261US8496158B2Method and apparatus for monitoring free air ball (FAB) formation in wire bondingZONG FEI·Filed 2012·Granted Jul 30, 2013·3 cites·15 claims
- 0359US9613941B2Exposed die power semiconductor deviceXU YANBO·Filed 2014·Granted Apr 4, 2017·2 cites·6 claims
- 0444US9252114B2Semiconductor device grid array packageWANG ZHIJIE·Filed 2014·Granted Feb 2, 2016·0 cites·16 claims
- 0541US9214413B2Semiconductor die package with pre-molded dieWANG ZHIJIE·Filed 2014·Granted Dec 15, 2015·0 cites·17 claims
- 0639US2015235969A1Backside metallization patterns for integrated circuitsZHANG HANMIN·Filed 2014·Application pending·0 cites
- 0732US2014103096A1Wire bonding machine and method for testing wire bond connectionsZHANG HANMIN·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →