Inventor · disambiguated record
Woon-Seob Lee
Also filed as: LEE WOON-SEOB
6 granted patents·26 citations·filing 2012–2023
78Inventor score
Top patents by PatentIndex Score
6 records- 0183US8841754B2Semiconductor devices with stress relief layersSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 23, 2014·8 cites·16 claims
- 0281US8890282B2Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 18, 2014·6 cites·20 claims
- 0376US12356611B2Semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2023·Granted Jul 8, 2025·0 cites·9 claims
- 0471US9147640B2Semiconductor devices having back side bonding structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 29, 2015·3 cites·17 claims
- 0571US8836109B2Semiconductor device and method of manufacturing a semiconductor deviceYUN KI-YOUNG·Filed 2012·Granted Sep 16, 2014·9 cites·15 claims
- 0667US11882694B2Semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2021·Granted Jan 23, 2024·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Woon-Seob Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →