Inventor · disambiguated record
Hsieh Ting Kuek
Also filed as: KUEK HSIEH TING
3 granted patents·1 pending application·11 citations·filing 2008–2018
62Inventor score
Top patents by PatentIndex Score
4 records- 0188US9922910B2Functionalized interface structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Mar 20, 2018·7 cites·24 claims
- 0268US10777536B2Semiconductor package with air cavityINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·2 cites·22 claims
- 0362US7977161B2Method of manufacturing a semiconductor package using a carrierINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 12, 2011·2 cites·23 claims
- 0434US2016365296A1Electronic Devices with Increased Creepage DistancesINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →