Inventor · disambiguated record
Yasushi Takizawa
Also filed as: TAKIZAWA YASUSHI
8 granted patents·2 pending applications·214 citations·filing 1987–2016
88Inventor score
Top patents by PatentIndex Score
10 records- 0182US4768070AOptoelectronics deviceHITACHI LTD·Filed 1987·Granted Aug 30, 1988·70 cites·20 claims
- 0281US6287371B1Non-electrolytic gold plating liquid and non-electrolytic gold plating method using sameLEARONAL JAPAN INC·Filed 1999·Granted Sep 11, 2001·62 cites·15 claims
- 0377US6736886B2Electroless gold plating bath and methodSHIPLEY CO LLC·Filed 2002·Granted May 18, 2004·17 cites·15 claims
- 0475US6383269B1Electroless gold plating solution and processSHIPLEY CO LLC·Filed 2000·Granted May 7, 2002·14 cites·18 claims
- 0573US5279760ACleaning agent compositions used for gas turbine air compressorsTOHOKU ELECTRIC POWER CO·Filed 1992·Granted Jan 18, 1994·39 cites·5 claims
- 0669US8142639B2Hard gold alloy plating bathORIHASHI MASANORI·Filed 2007·Granted Mar 27, 2012·1 cites·4 claims
- 0766US6991675B2Electroless displacement gold plating solution and additive for use in preparing plating solutionSHIPLEY CO LLC·Filed 2001·Granted Jan 31, 2006·10 cites·12 claims
- 0866US2010038254A1Tin electroplating solution and tin electroplating methodROHM & HAAS ELECT MAT·Filed 2009·Application pending·0 cites
- 0961US10804675B2To-can package semiconductor laser device having a pinless region on the underside of the packageUSHIO ELECTRIC INC·Filed 2016·Granted Oct 13, 2020·1 cites·9 claims
- 1057US2007068823A1Tin electroplating solution and tin electroplating methodROHM & HAAS ELECT MAT·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →