Inventor · disambiguated record
Seiichiro Shirai
Also filed as: SHIRAI SEIICHIRO
12 granted patents·3 pending applications·329 citations·filing 1987–2011
92Inventor score
Top patents by PatentIndex Score
15 records- 0193US5466325AResist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the methodNITTO DENKO CORP·Filed 1994·Granted Nov 14, 1995·83 cites·2 claims
- 0290US6329112B1Method for measuring aberration of projection lens, method for forming patterns, mask, and method for correcting a projection lensHITACHI LTD·Filed 1999·Granted Dec 11, 2001·59 cites·13 claims
- 0384US5436095AManufacturing method or an exposing method for a semiconductor device for a semiconductor integrated circuit device and a mask used thereforHITACHI LTD·Filed 1992·Granted Jul 25, 1995·65 cites·26 claims
- 0470US4835089AResist pattern forming process with dry etchingHITACHI LTD·Filed 1987·Granted May 30, 1989·22 cites·34 claims
- 0567US5736300AManufacturing method or an exposing method for a semiconductor device or a semiconductor integrated circuit device and a mask used thereforHITACHI LTD·Filed 1996·Granted Apr 7, 1998·25 cites·25 claims
- 0664US5405810AAlignment method and apparatusHITACHI LTD·Filed 1992·Granted Apr 11, 1995·36 cites·31 claims
- 0760US7875409B2Method of manufacturing semiconductor device, mask and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2006·Granted Jan 25, 2011·1 cites·9 claims
- 0859US8557611B2Manufacturing method of semiconductor device, exposure method, and exposure apparatusSHIRAI SEIICHIRO·Filed 2011·Granted Oct 15, 2013·1 cites·23 claims
- 0958US5959011AResist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the methodNITTO DENKO CORP·Filed 1996·Granted Sep 28, 1999·17 cites·8 claims
- 1057USRE37996EManufacturing method or an exposing method for a semiconductor device or a semiconductor integrated circuit device and a mask used thereforHITACHI LTD·Filed 2000·Granted Feb 18, 2003·4 cites·34 claims
- 1155US5578422AManufacturing method or an exposing method for a semiconductor device or a semiconductor integrated circuit device and a mask used thereforHITACHI LTD·Filed 1995·Granted Nov 26, 1996·15 cites·41 claims
- 1245US2011074049A1Method of manufacturing semiconductor device, mask and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 1343US2007076203A1Exposure apparatusRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 1430US6436220B1Process for the collective removal of resist material and side wall protective filmNITTO DENKO CORP·Filed 1998·Granted Aug 20, 2002·1 cites·5 claims
- 1530US2012156623A1Semiconductor device manufacturing method, exposure method for exposure apparatus, exposure apparatus, and light source for exposure apparatusSHIRAI SEIICHIRO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →