Inventor · disambiguated record
Liqing Wen
Also filed as: WEN LIQING · WEN LIQING (RICHARD)
14 granted patents·7 pending applications·14 citations·filing 2006–2025
86Inventor score
Files withFUJIFILM ELECTRONIC MAT USA INC14MAHULIKAR DEEPAK2TAIWAN SEMICONDUCTOR MFG CO LTD2FUJIFILM ELECTRIC MAT U S A INC1FUJIFILM PLANAR SOLUTIONS LLC1
Top patents by PatentIndex Score
21 records- 0182US11414568B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Aug 16, 2022·1 cites·20 claims
- 0282US8211193B2Ultrapure colloidal silica for use in chemical mechanical polishing applicationsMAHULIKAR DEEPAK·Filed 2006·Granted Jul 3, 2012·10 cites·16 claims
- 0381US12319843B2Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 0477US10676646B2Chemical mechanical polishing slurry for cobalt applicationsFUJIFILM PLANAR SOLUTIONS LLC·Filed 2018·Granted Jun 9, 2020·1 cites·17 claims
- 0577US2025277136A1Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2025·Application pending·0 cites
- 0676US2025361345A1Brush for cleaning wafers after chemical mechanical polishing (cmp) processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0775US2025333622A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2025·Application pending·0 cites
- 0871US12024650B2Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Jul 2, 2024·0 cites·21 claims
- 0969US11851585B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted Dec 26, 2023·0 cites·19 claims
- 1069US8779011B2Ultrapure colloidal silica for use in chemical mechanical polishing applicationsMAHULIKAR DEEPAK·Filed 2012·Granted Jul 15, 2014·2 cites·7 claims
- 1164US2024180324A1Brush for cleaning wafers after chemical mechanical polishing (cmp) processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1263US11505718B2Barrier ruthenium chemical mechanical polishing slurryFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Nov 22, 2022·0 cites·25 claims
- 1362US12371589B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Jul 29, 2025·0 cites·21 claims
- 1462US11999876B2Bulk ruthenium chemical mechanical polishing compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted Jun 4, 2024·0 cites·10 claims
- 1555US11034859B2Barrier ruthenium chemical mechanical polishing slurryFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Jun 15, 2021·0 cites·32 claims
- 1654US11279850B2Bulk ruthenium chemical mechanical polishing compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 1753US11732157B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Aug 22, 2023·0 cites·46 claims
- 1849US2007254964A1Ultrapure colloidal silica for use in chemical mechanical polishing applicationsPLANAR SOLUTIONS LLC·Filed 2007·Application pending·0 cites
- 1947US12398291B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Aug 26, 2025·0 cites·21 claims
- 2043US2021087431A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Application pending·0 cites
- 2143US2022195242A1Chemical mechanical polishing compositions and methods of use thereofFUJIFILM ELECTRIC MAT U S A INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →