Inventor · disambiguated record
Hae-Gu Lee
Also filed as: LEE HAE-GU
4 granted patents·1 pending application·6 citations·filing 2015–2019
61Inventor score
Top patents by PatentIndex Score
5 records- 0184US9665122B2Semiconductor device having markings and package on package including the sameKWON HEUNG KYU·Filed 2015·Granted May 30, 2017·6 cites·20 claims
- 0257US11004754B2X-ray topographic apparatus and substrate processing system using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
- 0353US10504804B2Laser processing method, substrate dicing method and substrate processing system for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 0439US10950480B2Adhesive tape sticking apparatus and method of manufacturing a semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 16, 2021·0 cites·19 claims
- 0531US2016005654A1System for manufacturing a semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →