Inventor · disambiguated record
Yen-Jui Chu
Also filed as: CHU YEN-JUI
13 granted patents·4 pending applications·5 citations·filing 2017–2024
82Inventor score
Files withWINBOND ELECTRONICS CORP17
Top patents by PatentIndex Score
17 records- 0192US10697919B2Reduction-oxidation sensor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted Jun 30, 2020·5 cites·13 claims
- 0273US2025196286A1Polishing pad and chemical mechanical polishing apparatusWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0368US11658138B2Semiconductor device including uneven contact in passivation layerWINBOND ELECTRONICS CORP·Filed 2022·Granted May 23, 2023·0 cites·9 claims
- 0463US11309267B2Semiconductor device including uneven contact in passivation layer and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Apr 19, 2022·0 cites·9 claims
- 0562US11610857B2Method of manufacturing circuit structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Mar 21, 2023·0 cites·10 claims
- 0660US2025029875A1Packing structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0756US11322438B2Package structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 0853US12119261B2Semiconductor structure and manufacturing method of the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 15, 2024·0 cites·19 claims
- 0950US10658320B1Semiconductor device including conductive structureWINBOND ELECTRONICS CORP·Filed 2019·Granted May 19, 2020·0 cites·10 claims
- 1050US2020251435A1Circuit structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 1149US11145596B2Package structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Oct 12, 2021·0 cites·10 claims
- 1248US10842421B2Sensing device, nursing bra, and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2017·Granted Nov 24, 2020·0 cites·14 claims
- 1346US11063010B2Redistribution layer (RDL) structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Jul 13, 2021·0 cites·14 claims
- 1446US10282964B2Gas detecting deviceWINBOND ELECTRONICS CORP·Filed 2017·Granted May 7, 2019·0 cites·10 claims
- 1546US10277995B2Bone conduction hearing aid device and bone conduction speakerWINBOND ELECTRONICS CORP·Filed 2017·Granted Apr 30, 2019·0 cites·12 claims
- 1641US2020350268A1Wire bonding structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 1739US10818497B2Patterned structure for electronic device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2017·Granted Oct 27, 2020·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →