Inventor · disambiguated record
Jianbo Ling
Also filed as: LING JIANBO
3 granted patents·2 pending applications·8 citations·filing 2015–2021
58Inventor score
Top patents by PatentIndex Score
5 records- 0181US11505359B2PackageSHENZHEN SMOORE TECHNOLOGY LTD·Filed 2021·Granted Nov 22, 2022·6 cites·8 claims
- 0268US11042680B2IC test information management system based on industrial internetSINO IC TECH CO LTD·Filed 2019·Granted Jun 22, 2021·2 cites·11 claims
- 0334US10613145B2Configuration and testing method and system for FPGA chip using bumping processSINO IC TECH CO LTD·Filed 2016·Granted Apr 7, 2020·0 cites·12 claims
- 0433US2020309845A1Optimization method for integrated circuit wafer testSINO IC TECH CO LTD·Filed 2018·Application pending·0 cites
- 0527US2016223612A1Ieee 1149.1 standard based testing methods used in packagingSINO IC TECH CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →