Inventor · disambiguated record
James E. Tappan
Also filed as: TAPPAN JAMES · TAPPAN JAMES E
24 granted patents·3 pending applications·296 citations·filing 1990–2021
95Inventor score
Top patents by PatentIndex Score
27 records- 0196US5200232AReaction chamber design and method to minimize particle generation in chemical vapor deposition reactorsLAM RES CORP·Filed 1990·Granted Apr 6, 1993·132 cites·12 claims
- 0295US8552334B2Adjustable gap capacitively coupled RF plasma reactor including lateral bellows and non-contact particle sealTAPPAN JAMES E·Filed 2009·Granted Oct 8, 2013·68 cites·17 claims
- 0387US10049862B2Chamber with vertical support stem for symmetric conductance and RF deliveryLAM RES CORP·Filed 2016·Granted Aug 14, 2018·4 cites·25 claims
- 0487US8735765B2Adjustable gap capacitively coupled RF plasma reactor including lateral bellows and non-contact particle sealLAM RES CORP·Filed 2013·Granted May 27, 2014·7 cites·9 claims
- 0585US8735298B2Method for spatial and temporal control of temperature on a substrateLAM RES CORP·Filed 2012·Granted May 27, 2014·4 cites·21 claims
- 0685US8038796B2Apparatus for spatial and temporal control of temperature on a substrateLAM RES CORP·Filed 2004·Granted Oct 18, 2011·21 cites·19 claims
- 0783US8257548B2Electrode orientation and parallelism adjustment mechanism for plasma processing systemsTAPPAN JAMES E·Filed 2008·Granted Sep 4, 2012·6 cites·19 claims
- 0881US8051556B2Method of manufacturing apparatus for spatial and temporal control of temperature on a substrateLAM RES CORP·Filed 2008·Granted Nov 8, 2011·4 cites·20 claims
- 0979US10037869B2Plasma processing devices having multi-port valve assembliesLAM RES CORP·Filed 2015·Granted Jul 31, 2018·2 cites·22 claims
- 1077US10665435B2Chamber with vertical support stem for symmetric conductance and RF deliveryLAM RES CORP·Filed 2019·Granted May 26, 2020·1 cites·20 claims
- 1176US7439499B2Multiple electrospray probe interface for mass spectrometryMETARA INC·Filed 2006·Granted Oct 21, 2008·4 cites·16 claims
- 1275US10395902B2Chamber with vertical support stem for symmetric conductance and RF deliveryLAM RES CORP·Filed 2018·Granted Aug 27, 2019·1 cites·27 claims
- 1373US11302556B2Apparatus for spatial and temporal control of temperature on a substrateLAM RES CORP·Filed 2020·Granted Apr 12, 2022·0 cites·19 claims
- 1472US8821639B2Apparatus for spatial and temporal control of temperature on a substrateRICCI ANTHONY J·Filed 2011·Granted Sep 2, 2014·2 cites·7 claims
- 1572US8394233B2Electrode orientation and parallelism adjustment mechanism for plasma processing systemsTAPPAN JAMES E·Filed 2012·Granted Mar 12, 2013·2 cites·10 claims
- 1668US6998095B2Loop dilution systemMETARA INC·Filed 2003·Granted Feb 14, 2006·7 cites·9 claims
- 1768US5368646AReaction chamber design to minimize particle generation in chemical vapor deposition reactorsLAM RES CORP·Filed 1994·Granted Nov 29, 1994·23 cites·28 claims
- 1864US8900404B2Plasma processing systems with mechanisms for controlling temperatures of componentsTAPPAN JAMES·Filed 2009·Granted Dec 2, 2014·2 cites·16 claims
- 1962US9103416B2Floating collar clamping device for auto-aligning nut and screw in linear motion leadscrew and nut assembly and methods thereofLAM RES CORP·Filed 2013·Granted Aug 11, 2015·1 cites·18 claims
- 2062US7132080B2Module for automated matrix removalMETARA INC·Filed 2003·Granted Nov 7, 2006·4 cites·21 claims
- 2160US10636689B2Apparatus for spatial and temporal control of temperature on a substrateLAM RES CORP·Filed 2014·Granted Apr 28, 2020·0 cites·18 claims
- 2258US12100575B2Plasma processing devices having multi-port valve assembliesLAM RES CORP·Filed 2018·Granted Sep 24, 2024·0 cites·30 claims
- 2354US8438712B2Floating collar clamping device for auto-aligning nut and screw in linear motion leadscrew and nut assemblyTAPPAN JAMES E·Filed 2009·Granted May 14, 2013·1 cites·8 claims
- 2450US12406872B2Semiconductor processing chamber with dual-lift mechanism for edge ring elevation managementLAM RES CORP·Filed 2021·Granted Sep 2, 2025·0 cites·20 claims
- 2549US2006128028A1Analysis of semiconductor copper plating bath chemistry using in process mass spectrometryANDERSON MARC R·Filed 2006·Application pending·0 cites
- 2648US2006133964A1Closed loop automated matrix removalBAILEY THOMAS H·Filed 2005·Application pending·0 cites
- 2746US2006065523A1Corrosion resistant apparatus for control of a multi-zone nozzle in a plasma processing systemHAO FANGLI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →